Okayama; Hiroshi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Okayama; Hiroshi.The latest application filed is for "multilayer wiring board".
- Okayama; Hiroshi - Tokyo JP
- Okayama; Hiroshi - Kumamoto JP
| Patent | Date |
|---|---|
| Multilayer wiring board Grant 9,271,391 - Okayama , et al. February 23, 2 | 2016-02-23 |
| Multilayer Wiring Board App 20130313003 - Okayama; Hiroshi ; et al. | 2013-11-28 |
| Magnetic head including a recessed magnetic metal film Grant 5,729,412 - Uemura , et al. March 17, 1 | 1998-03-17 |
| Magnetic head with metallic magnetic film and protective film means Grant 5,481,422 - Okayama , et al. January 2, 1 | 1996-01-02 |
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