OKAWA; Yuji
Patent Applications and Registrations
Patent applications and USPTO patent grants for OKAWA; Yuji.The latest application filed is for "masking tape for forming electromagnetic wave shield".
- OKAWA; Yuji - Ibaraki-shi JP
- Okawa; Yuji - Ibaraki JP
- OKAWA; Yuji - Osaka JP
- Okawa; Yuji - Kariya N/A JP
- Okawa; Yuji - Kariya-shi JP
- Okawa; Yuji - Tokyo JP
| Patent | Date |
|---|---|
| Masking Tape For Forming Electromagnetic Wave Shield App 20210269682 - OKAWA; Yuji | 2021-09-02 |
| Masking Pressure-sensitive Adhesive Tape App 20210040359 - OKAWA; Yuji | 2021-02-11 |
| Masking pressure-sensitive adhesive tape Grant 10,858,552 - Okawa December 8, 2 | 2020-12-08 |
| Masking Tape For Forming Electromagnetic Wave Shield App 20190225840 - OKAWA; Yuji | 2019-07-25 |
| Masking Pressure-sensitive Adhesive Tape App 20160355703 - OKAWA; Yuji | 2016-12-08 |
| Spindle device for machine tool Grant 8,827,609 - Ogura , et al. September 9, 2 | 2014-09-09 |
| Spindle device Grant 8,740,523 - Nakashima , et al. June 3, 2 | 2014-06-03 |
| Methylenebis (fatty Acid Amide) Composition, Adhesive Sheet, And Method For Manufacturing Thereof App 20130108867 - Ishiguro; Shigeki ; et al. | 2013-05-02 |
| Main spindle device Grant 8,206,068 - Takashima , et al. June 26, 2 | 2012-06-26 |
| Adhesive Tape Or Sheet With Release Liner App 20110244160 - ISHIGURO; Shigeki ; et al. | 2011-10-06 |
| Main spindle device Grant 7,997,838 - Takashima , et al. August 16, 2 | 2011-08-16 |
| Pressure-sensitive Adhesive Sheet App 20110195250 - OKAWA; Yuji | 2011-08-11 |
| Spindle Device For Machine Tool App 20110081216 - OGURA; Kazunari ; et al. | 2011-04-07 |
| Spindle Device App 20110020088 - NAKASHIMA; Kunimichi ; et al. | 2011-01-27 |
| Spindle Device For Machine Tool App 20110002570 - Ogura; Kazunari ; et al. | 2011-01-06 |
| Adhesive sheet for laser dicing and its manufacturing method Grant 7,767,556 - Okawa August 3, 2 | 2010-08-03 |
| Main Spindle Device App 20090263204 - TAKASHIMA; Toshiharu ; et al. | 2009-10-22 |
| Main Spindle Device App 20090263202 - TAKASHIMA; Toshiharu ; et al. | 2009-10-22 |
| Adhesive Sheet For Laser Dicing And Its Manufacturing Method App 20090253231 - Okawa; Yuji | 2009-10-08 |
| Adhesive sheet for laser dicing and its manufacturing method Grant 7,564,119 - Okawa July 21, 2 | 2009-07-21 |
| Pressure-sensitive Adhesive Sheet App 20070275201 - OKAWA; Yuji | 2007-11-29 |
| Pressure-sensitive adhesive tape or sheet for application to active surface in dicing and method of picking up chips of work App 20070190318 - Asai; Fumiteru ; et al. | 2007-08-16 |
| Wafer back surface treating method and dicing sheet adhering apparatus Grant 7,217,638 - Okawa May 15, 2 | 2007-05-15 |
| Ultraviolet irradiating method and an apparatus using the same Grant 7,091,499 - Okawa August 15, 2 | 2006-08-15 |
| Adhesive sheet for laser dicing and its manufacturing method App 20050186709 - Okawa, Yuji | 2005-08-25 |
| Wafer back surface treating method and dicing sheet adhering apparatus App 20040242002 - Okawa, Yuji | 2004-12-02 |
| Ultraviolet irradiating method and an apparatus using the same App 20040180515 - Okawa, Yuji | 2004-09-16 |
| Method of forming a polymer molecule chain Grant 6,656,662 - Okawa , et al. December 2, 2 | 2003-12-02 |
| Method for resist removal, and adhesive or adhesive sheet for use in the same Grant 6,126,772 - Yamamoto , et al. October 3, 2 | 2000-10-03 |
| Method for producing semiconductor element and adhesive sheet for adhering wafer Grant 5,759,874 - Okawa June 2, 1 | 1998-06-02 |
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