Okane; Noboru
Patent Applications and Registrations
Patent applications and USPTO patent grants for Okane; Noboru.The latest application filed is for "wire bonding apparatus and wire bonding method".
- Okane; Noboru - Yokkaichi JP
- Okane; Noboru - Yokkaichi-shi JP
| Patent | Date |
|---|---|
| Wire bonding apparatus and wire bonding method Grant 8,231,046 - Nakao , et al. July 31, 2 | 2012-07-31 |
| Wire Bonding Apparatus And Wire Bonding Method App 20100181367 - Nakao; Mitsuhiro ; et al. | 2010-07-22 |
| Semiconductor device and manufacturing method thereof Grant 7,569,921 - Okane , et al. August 4, 2 | 2009-08-04 |
| Wire Bonding Apparatus And Wire Bonding Method App 20080099532 - Nakao; Mitsuhiro ; et al. | 2008-05-01 |
| Semiconductor package and manufacturing method thereof App 20070023875 - Okane; Noboru ; et al. | 2007-02-01 |
| Semiconductor package App 20070023922 - Okane; Noboru ; et al. | 2007-02-01 |
| Semiconductor device and manufacturing method thereof App 20060232288 - Okane; Noboru ; et al. | 2006-10-19 |
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