Okamura; Kazuto

Patent Applications and Registrations

Patent applications and USPTO patent grants for Okamura; Kazuto.The latest application filed is for "substrate material for an hdd suspension".

Company Profile

0.3.7

Okamura; Kazuto - Kisarazu JP
Okamura; Kazuto - Chiba JP
Okamura; Kazuto - Tokyo-To JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the film Grant 8,066,891 - Sakayori , et al. November 29, 2	2011-11-29
Laminate and process for producing the same Grant 7,338,716 - Okamura , et al. March 4, 2	2008-03-04
Substrate material for an hdd suspension App 20070153423 - Shoji; Hiromasa ; et al.	2007-07-05
Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the film App 20070026678 - Sakayori; Katsuya ; et al.	2007-02-01
HDD suspension and its manufacture App 20060073316 - Okamura; Kazuto ; et al.	2006-04-06
Laminate for HDD Suspension With the use of Thin Copper Foil and Method for Manufacturing the same App 20060037674 - Okamura; Kazuto ; et al.	2006-02-23
Laminate and process for producing the same Grant 6,998,455 - Ohta , et al. February 14, 2	2006-02-14
Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the film App 20040096676 - Sakayori, Katsuya ; et al.	2004-05-20
Laminate and process for producing the same App 20040067349 - Okamura, Kazuto ; et al.	2004-04-08
HDD suspension and its manufacture App 20020155710 - Okamura, Kazuto ; et al.	2002-10-24

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