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name:-0.010930061340332
name:-0.011643886566162
Okamoto; Dan Patent Filings

Okamoto; Dan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Okamoto; Dan.The latest application filed is for "quad flat no lead package and method of making".

Company Profile
2.6.15
  • Okamoto; Dan - Oita JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Quad Flat No Lead Package And Method Of Making
App 20200251352 - Kind Code
2020-08-06
Quad flat no lead package and method of making
Grant 10,665,475 - Okamoto , et al.
2020-05-26
Lead Frame With Solder Sidewalls
App 20170352609 - Okamoto; Dan
2017-12-07
Lead Frame With Solder Sidewalls
App 20170271244 - Okamoto; Dan
2017-09-21
Circuit substrate interconnect
Grant 9,536,753 - Koto , et al. January 3, 2
2017-01-03
Dual Transistors Fabricated On Lead Frames And Method Of Fabrication
App 20160315036 - Shibuya; Makoto ;   et al.
2016-10-27
Method Of Making A Qfn Package
App 20160307831 - Okamoto; Dan
2016-10-20
Method of making a QFN package
Grant 9,379,087 - Okamoto June 28, 2
2016-06-28
QFN Package
App 20160133599 - Okamoto; Dan
2016-05-12
Circuit Substrate Interconnect
App 20160099226 - KOTO; Yohei ;   et al.
2016-04-07
Quad Flat No Lead Package And Method Of Making
App 20150364373 - Okamoto; Dan ;   et al.
2015-12-17
Solder Coated Clip And Integrated Circuit Packaging Method
App 20150348881 - Okamoto; Dan
2015-12-03
Integrated Circuit Die And Package
App 20150340324 - Hayata; Kazunori ;   et al.
2015-11-26
Semiconductor Die Collet and Method
App 20130264836 - OKAMOTO; Dan ;   et al.
2013-10-10
Semiconductor die collet
Grant 8,465,619 - Okamoto , et al. June 18, 2
2013-06-18
Semiconductor Die Collet and Method
App 20100289159 - OKAMOTO; Dan ;   et al.
2010-11-18
Semiconductor die collet and method
Grant 7,790,507 - Okamoto , et al. September 7, 2
2010-09-07
Semiconductor Die Collet and Method
App 20080233680 - Okamoto; Dan ;   et al.
2008-09-25
Method and apparatus for fine pitch solder joint
App 20070037376 - Okamoto; Dan
2007-02-15
Stress distribution package
App 20050133913 - Okamoto, Dan
2005-06-23

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