Okajima; Yasutomo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Okajima; Yasutomo.The latest application filed is for "method for processing substrate, apparatus for processing substrate, method for conveying substrate and mechanism for conveying substrate".

Company Profile

0.3.6

Okajima; Yasutomo - Osaka JP
Okajima; Yasutomo - Sulta-City Osaka 564-0044 JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for processing substrate, apparatus for processing substrate, method for conveying substrate and mechanism for conveying substrate Grant 7,845,529 - Okajima , et al. December 7, 2	2010-12-07
Substrate dividing system, substrate manufacturing equipment, substrate scribing method and substrate dividing method Grant 7,770,500 - Nishio , et al. August 10, 2	2010-08-10
Method For Processing Substrate, Apparatus For Processing Substrate, Method For Conveying Substrate And Mechanism For Conveying Substrate App 20090236384 - Okajima; Yasutomo ; et al.	2009-09-24
Substrate-cutting system, substrate-producing apparatus, substrate-scribing method, and substrate-cutting method Grant 7,426,883 - Nishio , et al. September 23, 2	2008-09-23
Method for Processing Substrate, Apparatus for Processing Substrate, Method for Conveying Substrate and Mechanism for Conveying Substrate App 20080190981 - Okajima; Yasutomo ; et al.	2008-08-14
Substrate Dividing System, Substrate Manufacturing Equipment, Substrate Scribing Method and Substrate Dividing Method App 20070281444 - Nishio; Yoshitaka ; et al.	2007-12-06
Substrate Dicing System, Substrate Manufacturing Apparatus, And Substrate Dicing Method App 20070214925 - Nishio; Yoshitaka ; et al.	2007-09-20
Substrate-cutting system, substrate-producing apparatus, substrate-scribing method, and substrate-cutting method App 20060137504 - Nishio; Yoshitaka ; et al.	2006-06-29
Pasted base board cutting system and base board cutting method App 20050229755 - Okajima, Yasutomo ; et al.	2005-10-20

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