Okada; Tsuneyoshi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Okada; Tsuneyoshi.The latest application filed is for "improvements in the encapsulation of electronic components employing low stress encapsulant composition".
- Okada; Tsuneyoshi - Kawasaki JP
- Okada; Tsuneyoshi - Fuji JP
| Patent | Date |
|---|---|
| Improvements in the encapsulation of electronic components employing low stress encapsulant composition Grant 5,091,135 - Okada , et al. February 25, 1 | 1992-02-25 |
| Gear comprising fiber-reinforced anisotropic melt-forming polymer formed via injection molding under specified conditions Grant 4,777,204 - Ikenaga , et al. October 11, 1 | 1988-10-11 |
| Process for producing electroconductive resin composite Grant 4,772,421 - Ikenaga , et al. September 20, 1 | 1988-09-20 |
| Metallic film with laminated layer of an anisotropic melt phase forming polymer Grant 4,737,398 - Ikenaga , et al. April 12, 1 | 1988-04-12 |
| Magnetic disk Grant 4,726,998 - Ikenaga , et al. February 23, 1 | 1988-02-23 |
| Optical disc Grant 4,719,171 - Ikenaga , et al. January 12, 1 | 1988-01-12 |
| Method of manufacturing a molded article having good dimensional stability Grant 4,717,624 - Ikenaga , et al. January 5, 1 | 1988-01-05 |
| Polyacetal resin composition Grant 4,649,172 - Yanase , et al. March 10, 1 | 1987-03-10 |
| Magnetic composite Grant 4,626,371 - Ikenaga , et al. December 2, 1 | 1986-12-02 |
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