loadpatents
name:-0.057185888290405
name:-0.053409814834595
name:-0.051894903182983
Okada; Sakie Patent Filings

Okada; Sakie

Patent Applications and Registrations

Patent applications and USPTO patent grants for Okada; Sakie.The latest application filed is for "flux and solder paste using the same".

Company Profile
1.4.13
  • Okada; Sakie - Tokyo JP
  • Okada; Sakie - Tochigi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Flux and solder paste using the same
Grant 11,298,780 - Kawamata , et al. April 12, 2
2022-04-12
Flux and Solder Paste Using the Same
App 20210299799 - Kawamata; Hiroaki ;   et al.
2021-09-30
Flux and Solder Paste Using the Same
App 20210213570 - Kawano; Yusuke ;   et al.
2021-07-15
Solder paste
Grant 10,350,712 - Koroki , et al. July 16, 2
2019-07-16
Method of printing solder paste
Grant 10,322,462 - Okada
2019-06-18
Solder paste
Grant 9,987,710 - Koroki , et al. June 5, 2
2018-06-05
Solder Paste
App 20170157691 - OKADA; Sakie
2017-06-08
Flux
App 20170120397 - OKADA; Sakie ;   et al.
2017-05-04
Solder Paste
App 20160158896 - Koroki; Motoki ;   et al.
2016-06-09
Solder Paste
App 20160158897 - Koroki; Motoki ;   et al.
2016-06-09
Solder Paste
App 20150027589 - Okada; Sakie ;   et al.
2015-01-29
Solder Paste
App 20140130940 - Okada; Sakie
2014-05-15
Flux
App 20130333806 - Okada; Sakie ;   et al.
2013-12-19
Flux
App 20130333807 - Okada; Sakie ;   et al.
2013-12-19

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