loadpatents
Patent applications and USPTO patent grants for Okada; Sakie.The latest application filed is for "flux and solder paste using the same".
Patent | Date |
---|---|
Flux and solder paste using the same Grant 11,298,780 - Kawamata , et al. April 12, 2 | 2022-04-12 |
Flux and Solder Paste Using the Same App 20210299799 - Kawamata; Hiroaki ;   et al. | 2021-09-30 |
Flux and Solder Paste Using the Same App 20210213570 - Kawano; Yusuke ;   et al. | 2021-07-15 |
Solder paste Grant 10,350,712 - Koroki , et al. July 16, 2 | 2019-07-16 |
Method of printing solder paste Grant 10,322,462 - Okada | 2019-06-18 |
Solder paste Grant 9,987,710 - Koroki , et al. June 5, 2 | 2018-06-05 |
Solder Paste App 20170157691 - OKADA; Sakie | 2017-06-08 |
Flux App 20170120397 - OKADA; Sakie ;   et al. | 2017-05-04 |
Solder Paste App 20160158896 - Koroki; Motoki ;   et al. | 2016-06-09 |
Solder Paste App 20160158897 - Koroki; Motoki ;   et al. | 2016-06-09 |
Solder Paste App 20150027589 - Okada; Sakie ;   et al. | 2015-01-29 |
Solder Paste App 20140130940 - Okada; Sakie | 2014-05-15 |
Flux App 20130333806 - Okada; Sakie ;   et al. | 2013-12-19 |
Flux App 20130333807 - Okada; Sakie ;   et al. | 2013-12-19 |
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