Okada; Mitsuyuki
Patent Applications and Registrations
Patent applications and USPTO patent grants for Okada; Mitsuyuki.The latest application filed is for "adhesive resin composition".
- Okada; Mitsuyuki - Ichihara JP
- Okada; Mitsuyuki - Chiba JP
- Okada; Mitsuyuki - Niihama JA
| Patent | Date |
|---|---|
| Adhesive resin composition Grant 5,296,552 - Ohmae , et al. March 22, 1 | 1994-03-22 |
| Modified polyolefin resin Grant 5,032,459 - Toyoshima , et al. July 16, 1 | 1991-07-16 |
| Thermoplastic resin composition Grant 4,981,896 - Okada , et al. January 1, 1 | 1991-01-01 |
| Vibration-damping material Grant 4,883,717 - Kitamura , et al. November 28, 1 | 1989-11-28 |
| Lead accumulator Grant 4,859,710 - Ohmae , et al. August 22, 1 | 1989-08-22 |
| Adhesive resin composition Grant 4,771,106 - Ohmae , et al. September 13, 1 | 1988-09-13 |
| Adhesive resin composition Grant 4,720,524 - Ohmae , et al. January 19, 1 | 1988-01-19 |
| Method for preparation of ionically crosslinked ethylene copolymers Grant 4,042,766 - Tatsukami , et al. August 16, 1 | 1977-08-16 |
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