Okada; Mikako
Patent Applications and Registrations
Patent applications and USPTO patent grants for Okada; Mikako.The latest application filed is for "semiconductor device".
- Okada; Mikako - Tokyo JP
- Okada; Mikako - Kanagawa JP
| Patent | Date |
|---|---|
| Semiconductor device with wiring substrate including conductive pads and testing conductive pads Grant 9,330,942 - Ishikawa , et al. May 3, 2 | 2016-05-03 |
| Semiconductor Device App 20140252357 - ISHIKAWA; Toshikazu ; et al. | 2014-09-11 |
| Semiconductor device Grant 8,766,425 - Ishikawa , et al. July 1, 2 | 2014-07-01 |
| Semiconductor device with wiring substrate including lower conductive pads and testing conductive pads Grant 8,698,299 - Ishikawa , et al. April 15, 2 | 2014-04-15 |
| Semiconductor Device App 20140070214 - ISHIKAWA; Toshikazu ; et al. | 2014-03-13 |
| Semiconductor device and manufacturing method therefor Grant 8,383,456 - Okada , et al. February 26, 2 | 2013-02-26 |
| Semiconductor Device And Manufacturing Method Therefor App 20120208322 - OKADA; MIKAKO ; et al. | 2012-08-16 |
| Semiconductor device, and manufacturing method therefor Grant 8,222,738 - Ota , et al. July 17, 2 | 2012-07-17 |
| Semiconductor Device App 20120153282 - ISHIKAWA; Toshikazu ; et al. | 2012-06-21 |
| Semiconductor device having wiring substrate stacked on another wiring substrate Grant 8,159,058 - Ishikawa , et al. April 17, 2 | 2012-04-17 |
| Semiconductor device and manufacturing method therefor Grant 8,159,057 - Okada , et al. April 17, 2 | 2012-04-17 |
| Semiconductor Device, And Manufacturing Method Therefor App 20110300672 - OTA; Yusuke ; et al. | 2011-12-08 |
| Semiconductor device, and manufacturing method therefor Grant 8,021,932 - Ota , et al. September 20, 2 | 2011-09-20 |
| Semiconductor Device, And Manufacturing Method Therefor App 20090294978 - OTA; Yusuke ; et al. | 2009-12-03 |
| Semiconductor Device And Manufacturing Method Therefor App 20090294945 - Okada; Mikako ; et al. | 2009-12-03 |
| Semiconductor Device App 20090065773 - ISHIKAWA; Toshikazu ; et al. | 2009-03-12 |
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