OKADA; Issei

Patent Applications and Registrations

Patent applications and USPTO patent grants for OKADA; Issei.The latest application filed is for "method of manufacturing copper nano-ink and copper nano-ink".

Company Profile

10.13.27

OKADA; Issei - Osaka JP
OKADA; Issei - Osaka-shi Osaka
OKADA; Issei - Kanagawa JP
Okada; Issei - Osaki JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method Of Manufacturing Copper Nano-ink And Copper Nano-ink App 20210291271 - OKADA; Issei ; et al.	2021-09-23
Base material for printed circuit board and printed circuit board Grant 11,013,113 - Sugiura , et al. May 18, 2	2021-05-18
Base Material For Printed Circuit Board And Printed Circuit Board App 20210022245 - SUGIURA; Motohiko ; et al.	2021-01-21
Method Of Manufacturing Substrate For Printed Circuit Board App 20200344890 - SUGIURA; Motohiko ; et al.	2020-10-29
Base Material For Printed Circuit Board And Printed Circuit Board App 20200324517 - SUGIURA; Motohiko ; et al.	2020-10-15
Coating liquid for forming conductive layer, method for producing conductive layer, and conductive layer Grant 10,796,812 - Sugiura , et al. October 6, 2	2020-10-06
Powder for conductive material, ink for conductive material, conductive paste, and method for producing powder for conductive material Grant 10,610,928 - Okada , et al.	2020-04-07
Metal powder, ink, sintered body, substrate for printed circuit board, and method for manufacturing metal powder Grant 10,307,825 - Okada , et al.	2019-06-04
Coating Liquid For Forming Conductive Layer, Method For Producing Conductive Layer, And Conductive Layer App 20190077974 - SUGIURA; Motohiko ; et al.	2019-03-14
Powder For Conductive Material, Ink For Conductive Material, Conductive Paste, And Method For Producing Powder For Conductive Material App 20190054524 - OKADA; Issei ; et al.	2019-02-21
Coating Liquid For Forming Conductive Layer And Method For Manufacturing Conductive Layer App 20180315519 - SUGIURA; Motohiko ; et al.	2018-11-01
Method For Manufacturing Titanium Trichloride Solution And Device For Manufacturing Titanium Trichloride Solution App 20180305829 - OKADA; Issei ; et al.	2018-10-25
Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board Grant 9,967,976 - Miyata , et al. May 8, 2	2018-05-08
Metal Powder, Ink, Sintered Body, Substrate For Printed Circuit Board, And Method For Manufacturing Metal Powder App 20180015547 - OKADA; Issei ; et al.	2018-01-18
Substrate For Printed Circuit Board, Printed Circuit Board, And Method For Producing Substrate For Printed Circuit Board App 20170347459 - MIYATA; Kazuhiro ; et al.	2017-11-30
Metal Nanoparticle Dispersion And Metal Coating Film App 20170213615 - OKADA; Issei ; et al.	2017-07-27
Method For Producing Printed Wiring Board App 20160330847 - OKA; Yoshio ; et al.	2016-11-10
Method For Producing Printed Wiring Board App 20160330850 - OKA; Yoshio ; et al.	2016-11-10
Water-slidable/oil-slidable Film, Production Method Thereof, And Articles Having The Surface Coated Therewith App 20150376535 - SHIRATORI; Seimei ; et al.	2015-12-31
Substrate For Printed Wiring Board, Printed Wiring Board, And Methods For Producing Same App 20140166495 - OKA; Yoshio ; et al.	2014-06-19
Metal coating, forming method thereof, and metal wiring Grant 8,507,104 - Okada , et al. August 13, 2	2013-08-13
Substrate For Printed Wiring Board, Printed Wiring Board, And Methods For Producing Same App 20120031656 - Oka; Yoshio ; et al.	2012-02-09
Method for manufacturing electronic circuit component Grant 8,026,185 - Maeda , et al. September 27, 2	2011-09-27
Conductive Adhesive And Led Substrate Using The Same App 20110140162 - Okada; Issei ; et al.	2011-06-16
Nickel Powder Or Alloy Powder Comprising Nickel As Main Component, Method For Producing The Same, Conductive Paste And Laminated Ceramic Capacitor App 20110141654 - Okada; Issei	2011-06-16
Nickel Powder Or Alloy Powder Having Nickel As Main Component, Method For Manufacturing The Powder, Conductive Paste And Laminated Ceramic Capacitor App 20100208410 - Okada; Issei ; et al.	2010-08-19
Granular metal powder Grant 7,691,175 - Shimoda , et al. April 6, 2	2010-04-06
Method For Manufacturing Electronic Circuit Component App 20100003791 - Maeda; Shinichi ; et al.	2010-01-07
Metallic colloidal solution and inkjet-use metallic ink Grant 7,608,203 - Okada , et al. October 27, 2	2009-10-27
Metal coating, forming method thereof, and metal wiring App 20090197045 - Okada; Issei ; et al.	2009-08-06
Method of producing metal powder Grant 7,510,592 - Majima , et al. March 31, 2	2009-03-31
Metallic Colloidal Solution And Inkjet-use Metallic Ink App 20080308001 - OKADA; Issei ; et al.	2008-12-18
Metallic colloidal solution and inkjet-use metallic ink Grant 7,445,731 - Okada , et al. November 4, 2	2008-11-04
Method of manufacturing chain-structure metal powder Grant 7,285,152 - Shimoda , et al. October 23, 2	2007-10-23
Method of producing metal powder App 20070089565 - Majima; Masatoshi ; et al.	2007-04-26
Granular metal powder App 20070074598 - Shimoda; Kohei ; et al.	2007-04-05
Method of forming a conductive wiring pattern by laser irradiation and a conductive wiring pattern App 20060057502 - Okada; Issei ; et al.	2006-03-16
Metallic colloidal solution and inkjet-use metallic ink App 20050189520 - Okada, Issei ; et al.	2005-09-01
Chain-structure metal powder, manufacturing method thereof, and conductivity-afforded material App 20040221683 - Shimoda, Kohei ; et al.	2004-11-11

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