Okabayashi; Hidekazu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Okabayashi; Hidekazu.The latest application filed is for "copper interconnection".
- Okabayashi; Hidekazu - Tokyo JP
| Patent | Date |
|---|---|
| Copper interconnection Grant 6,670,639 - Okabayashi , et al. December 30, 2 | 2003-12-30 |
| Method for forming an aluminum film used as an interconnect in a semiconductor device Grant 5,545,591 - Sugai , et al. August 13, 1 | 1996-08-13 |
| Method for fabricating semiconductor device Grant 5,308,792 - Okabayashi , et al. May 3, 1 | 1994-05-03 |
| Method of manufacturing semiconductor device Grant 4,558,507 - Okabayashi , et al. December 17, 1 | 1985-12-17 |
| Process of forming electrodes and interconnections on silicon semiconductor devices Grant 4,551,908 - Nagasawa , et al. November 12, 1 | 1985-11-12 |
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