| Patent | Date |
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Flexible Printed Circuit Board And Method Of Manufacturing Same
App 20220295637 - SAKAI; Shoichiro ; et al. | 2022-09-15 |
Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board
Grant 11,375,615 - Yamanaka , et al. June 28, 2 | 2022-06-28 |
Method of making printed circuit board and laminated structure
Grant 11,343,918 - Uemura , et al. May 24, 2 | 2022-05-24 |
Method of manufacturing flexible printed interconnect board
Grant 11,245,237 - Adachi , et al. February 8, 2 | 2022-02-08 |
Flexible Printed Circuit Board And Method Of Manufacturing Flexible Printed Circuit Board
App 20210219425 - OKA; Yoshio ; et al. | 2021-07-15 |
Flexible Printed Circuit Board And Method Of Manufacturing Flexible Printed Circuit Board
App 20210219424 - NITTA; Koji ; et al. | 2021-07-15 |
Flexible printed circuit board
Grant 11,051,399 - Oka , et al. June 29, 2 | 2021-06-29 |
Base material for printed circuit board and printed circuit board
Grant 11,013,113 - Sugiura , et al. May 18, 2 | 2021-05-18 |
Board with terminal
Grant 10,965,046 - Shimada , et al. March 30, 2 | 2021-03-30 |
Method Of Making Printed Circuit Board And Laminated Structure
App 20210045250 - UEMURA; Shigeaki ; et al. | 2021-02-11 |
Method Of Manufacturing Flexible Printed Interconnect Board
App 20210044067 - ADACHI; Yoshiro ; et al. | 2021-02-11 |
Flexible Printed Circuit Board
App 20210037642 - OKA; Yoshio ; et al. | 2021-02-04 |
Base Material For Printed Circuit Board And Printed Circuit Board
App 20210022245 - SUGIURA; Motohiko ; et al. | 2021-01-21 |
Resin film, substrate for printed wiring board, and printed wiring board
Grant 10,889,086 - Hashizume , et al. January 12, 2 | 2021-01-12 |
Resin Film, Substrate For Printed Wiring Board, And Printed Wiring Board
App 20200376810 - HASHIZUME; Kayo ; et al. | 2020-12-03 |
Board With Terminal
App 20200366009 - SHIMADA; Takanobu ; et al. | 2020-11-19 |
Base material for printed circuit board and printed circuit board
Grant 10,842,027 - Miyata , et al. November 17, 2 | 2020-11-17 |
Coating liquid for forming conductive layer, method for producing conductive layer, and conductive layer
Grant 10,796,812 - Sugiura , et al. October 6, 2 | 2020-10-06 |
Base Material For Printed Circuit Board And Printed Circuit Board
App 20200288578 - MIYATA; Kazuhiro ; et al. | 2020-09-10 |
Flexible printed circuit board
Grant 10,709,016 - Oka , et al. | 2020-07-07 |
Flexible Printed Circuit Board
App 20200214129 - ADACHI; Yoshiro ; et al. | 2020-07-02 |
Flexible Printed Circuit Board
App 20200113046 - OKA; Yoshio ; et al. | 2020-04-09 |
Powder for conductive material, ink for conductive material, conductive paste, and method for producing powder for conductive material
Grant 10,610,928 - Okada , et al. | 2020-04-07 |
Substrate for printed circuit board and printed circuit board
Grant 10,596,782 - Hashizume , et al. | 2020-03-24 |
Metal powder, ink, sintered body, substrate for printed circuit board, and method for manufacturing metal powder
Grant 10,307,825 - Okada , et al. | 2019-06-04 |
Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board
Grant 10,292,265 - Kasuga , et al. | 2019-05-14 |
Substrate for printed wiring board and method for producing the same, printed wiring board and method for producing the same, and resin base material
Grant 10,244,627 - Hashizume , et al. | 2019-03-26 |
Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board
Grant 10,237,976 - Kasuga , et al. | 2019-03-19 |
Coating Liquid For Forming Conductive Layer, Method For Producing Conductive Layer, And Conductive Layer
App 20190077974 - SUGIURA; Motohiko ; et al. | 2019-03-14 |
Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board
Grant 10,225,931 - Hashizume , et al. | 2019-03-05 |
Powder For Conductive Material, Ink For Conductive Material, Conductive Paste, And Method For Producing Powder For Conductive Material
App 20190054524 - OKADA; Issei ; et al. | 2019-02-21 |
Base Film For Printed Circuit Board, Substrate For Printed Circuit Board, And Method For Manufacturing Substrate For Printed Circuit Board
App 20180371191 - HASHIZUME; Kayo ; et al. | 2018-12-27 |
Substrate for printed circuit board and method for producing substrate for printed circuit board
Grant 10,143,083 - Sugiura , et al. Nov | 2018-11-27 |
Coating Device And Method Of Producing Coated Sheet
App 20180333739 - MIYATA; Kazuhiro ; et al. | 2018-11-22 |
Coating Liquid For Forming Conductive Layer And Method For Manufacturing Conductive Layer
App 20180315519 - SUGIURA; Motohiko ; et al. | 2018-11-01 |
Method For Manufacturing Titanium Trichloride Solution And Device For Manufacturing Titanium Trichloride Solution
App 20180305829 - OKADA; Issei ; et al. | 2018-10-25 |
Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board
Grant 10,076,032 - Kasuga , et al. September 11, 2 | 2018-09-11 |
Substrate for printed circuit board, printed circuit board, and method for producing printed circuit board
Grant 10,076,028 - Kasuga , et al. September 11, 2 | 2018-09-11 |
Substrate For Printed Circuit Board, Printed Circuit Board, And Method For Producing Substrate For Printed Circuit Board
App 20180242450 - YAMANAKA; Yuichiro ; et al. | 2018-08-23 |
Substrate For Printed Circuit Board And Printed Circuit Board
App 20180147815 - HASHIZUME; Kayo ; et al. | 2018-05-31 |
Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board
Grant 9,967,976 - Miyata , et al. May 8, 2 | 2018-05-08 |
Substrate For Printed Circuit Board, Printed Circuit Board, And Method For Producing Substrate For Printed Circuit Board
App 20180124925 - HASHIZUME; Kayo ; et al. | 2018-05-03 |
Metal Powder, Ink, Sintered Body, Substrate For Printed Circuit Board, And Method For Manufacturing Metal Powder
App 20180015547 - OKADA; Issei ; et al. | 2018-01-18 |
Substrate For Printed Circuit Board, Printed Circuit Board, And Method For Producing Printed Circuit Board
App 20180014403 - KASUGA; Takashi ; et al. | 2018-01-11 |
Substrate For Printed Circuit Board And Method For Producing Substrate For Printed Circuit Board
App 20170347449 - SUGIURA; Motohiko ; et al. | 2017-11-30 |
Substrate For Printed Circuit Board, Printed Circuit Board, And Method For Producing Substrate For Printed Circuit Board
App 20170347459 - MIYATA; Kazuhiro ; et al. | 2017-11-30 |
Substrate For Printed Wiring Board And Method For Producing The Same, Printed Wiring Board And Method For Producing The Same, And Resin Base Material
App 20170347464 - HASHIZUME; Kayo ; et al. | 2017-11-30 |
Substrate For Printed Circuit Board, Printed Circuit Board, And Method For Producing Substrate For Printed Circuit Board
App 20170290150 - KASUGA; Takashi ; et al. | 2017-10-05 |
Substrate For Printed Circuit Board, Printed Circuit Board, And Method For Producing Substrate For Printed Circuit Board
App 20170127516 - KASUGA; Takashi ; et al. | 2017-05-04 |
Substrate For Printed Circuit Board, Printed Circuit Board, And Method For Producing Substrate For Printed Circuit Board
App 20170099732 - KASUGA; Takashi ; et al. | 2017-04-06 |
Method For Producing Printed Wiring Board
App 20160330847 - OKA; Yoshio ; et al. | 2016-11-10 |
Method For Producing Printed Wiring Board
App 20160330850 - OKA; Yoshio ; et al. | 2016-11-10 |
Double-sided Printed Wiring Board And Method For Producing The Same
App 20140332258 - Uchida; Yoshifumi ; et al. | 2014-11-13 |
Printed wiring board and method for manufacturing the same
Grant 8,866,027 - Oka , et al. October 21, 2 | 2014-10-21 |
Substrate For Printed Wiring Board, Printed Wiring Board, And Methods For Producing Same
App 20140166495 - OKA; Yoshio ; et al. | 2014-06-19 |
Apoptosis inductor extracted from potato, potato foodstuff containing the inductor, and processed product thereof
Grant 8,709,504 - Hibasami , et al. April 29, 2 | 2014-04-29 |
Conductive paste and multilayer printed wiring board using the same
Grant 8,617,688 - Oka , et al. December 31, 2 | 2013-12-31 |
Conductive paste and multilayer printed wiring board using the same
Grant 08617688 - | 2013-12-31 |
Conductive paste and method for manufacturing multilayer printed wiring board using the same
Grant 8,597,459 - Oka , et al. December 3, 2 | 2013-12-03 |
Flexible printed wiring board
Grant 8,309,853 - Oka , et al. November 13, 2 | 2012-11-13 |
Method for producing printed wiring board
Grant 8,231,766 - Hayashi , et al. July 31, 2 | 2012-07-31 |
Substrate For Printed Wiring Board, Printed Wiring Board, And Methods For Producing Same
App 20120031656 - Oka; Yoshio ; et al. | 2012-02-09 |
Apoptosis Inductor Extracted From Potato, Potato Foodstuff Containing The Inductor, And Processed Product Thereof
App 20110092586 - HIBASAMI; Hiroshige ; et al. | 2011-04-21 |
Flexible Printed Wiring Board
App 20100116525 - Oka; Yoshio ; et al. | 2010-05-13 |
Printed Wiring Board And Method For Manufacturing The Same
App 20100044094 - Oka; Yoshio ; et al. | 2010-02-25 |
Conductive paste and multilayer printed wiring board using the same
App 20090220738 - Oka; Yoshio ; et al. | 2009-09-03 |
Conductive Paste and Method for Manufacturing Multilayer Printed Wiring Board Using the Same
App 20080099121 - Oka; Yoshio ; et al. | 2008-05-01 |
Board for printed wiring, printed wiring board, and method for manufacturing them
App 20080063792 - Hayashi; Noriki ; et al. | 2008-03-13 |
Board for printed wiring, printed wiring board, and method for manufacturing them
App 20050236182 - Hayashi, Noriki ; et al. | 2005-10-27 |
Apoptosis inductor extracted from potato, potato foodstuff containing the inductor, and processed product thereof
App 20040009249 - Hibasami, Hiroshige ; et al. | 2004-01-15 |
Snowmobile
Grant 5,947,220 - Oka , et al. September 7, 1 | 1999-09-07 |
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