| Patent | Date |
|---|
Ceramic wiring board and method for producing the same
Grant 11,350,523 - Sumi , et al. May 31, 2 | 2022-05-31 |
Ceramic electronic component
Grant 11,230,499 - Oka , et al. January 25, 2 | 2022-01-25 |
Construction machine equipped with boom
Grant 10,669,131 - Oka , et al. | 2020-06-02 |
Multilayer ceramic substrate
Grant 10,638,603 - Oka , et al. | 2020-04-28 |
Multilayer Ceramic Substrate
App 20200045811 - Oka; Takahiro ; et al. | 2020-02-06 |
Multilayer ceramic substrate
Grant 10,485,099 - Oka , et al. Nov | 2019-11-19 |
Electronic Device And Multilayer Ceramic Substrate
App 20190191565 - Oka; Takahiro ; et al. | 2019-06-20 |
Insulating ceramic paste, ceramic electronic component, and method for producing the same
Grant 10,292,264 - Nakamura , et al. | 2019-05-14 |
Multilayer Ceramic Substrate
App 20190069396 - Oka; Takahiro ; et al. | 2019-02-28 |
Ceramic Electronic Component And Method Of Manufacturing Ceramic Electronic Component
App 20190002351 - Oka; Takahiro ; et al. | 2019-01-03 |
Insulating Ceramic Paste, Ceramic Electronic Componet, And Method For Producing The Same
App 20180302982 - Nakamura; Sumiyo ; et al. | 2018-10-18 |
Construction Machine Equipped With Boom
App 20180134528 - OKA; Takahiro ; et al. | 2018-05-17 |
Insulating ceramic paste, ceramic electronic component, and method for producing the same
Grant 9,974,168 - Nakamura , et al. May 15, 2 | 2018-05-15 |
Ceramic Wiring Board And Method For Producing The Same
App 20170135205 - Sumi; Takahiro ; et al. | 2017-05-11 |
Triazole-isoxazole Compound And Medical Use Thereof
App 20160137639 - KOTOKU; Masayuki ; et al. | 2016-05-19 |
Insulating Ceramic Paste, Ceramic Electronic Componet, And Method For Producing The Same
App 20160014892 - Nakamura; Sumiyo ; et al. | 2016-01-14 |
Azetidine compound and pharmaceutical use thereof
Grant 8,765,739 - Ikegashira , et al. July 1, 2 | 2014-07-01 |
Method for forming silicon-containing dielectric film by cyclic deposition with side wall coverage control
Grant 8,722,546 - Fukazawa , et al. May 13, 2 | 2014-05-13 |
Method for Forming Silicon-Containing Dielectric Film by Cyclic Deposition with Side Wall Coverage Control
App 20130330933 - Fukazawa; Atsuki ; et al. | 2013-12-12 |
Method for forming single-phase multi-element film by PEALD
Grant 8,569,184 - Oka , et al. October 29, 2 | 2013-10-29 |
Method for Forming Single-Phase Multi-Element Film by PEALD
App 20130084714 - Oka; Takahiro ; et al. | 2013-04-04 |
Method of depositing silicon oxide film by plasma enhanced atomic layer deposition at low temperature
Grant 8,197,915 - Oka , et al. June 12, 2 | 2012-06-12 |
Tetracyclic Fused Heterocyclic Compound And Use Thereof As Hcv Polymerase Inhibitor
App 20120070409 - Oka; Takahiro ; et al. | 2012-03-22 |
5-5-membered Fused Heterocyclic Compound And Use Thereof As Hcv Polymerase Inhibitor
App 20120020920 - Mizojiri; Ryo ; et al. | 2012-01-26 |
Process for producing bent pipe for line pipe
Grant 8,038,811 - Oka October 18, 2 | 2011-10-18 |
Tetracyclic fused heterocyclic compound and use thereof as HCV polymerase inhibitor
Grant 7,977,331 - Oka , et al. July 12, 2 | 2011-07-12 |
Liquid crystal display device
Grant 7,907,241 - Fujita , et al. March 15, 2 | 2011-03-15 |
Azetidine Compound And Pharmaceutical Use Thereof
App 20100331301 - Ikegashira; Kazutaka ; et al. | 2010-12-30 |
Method of Depositing Silicon Oxide Film by Plasma Enhanced Atomic Layer Deposition at Low Temperature
App 20100255218 - Oka; Takahiro ; et al. | 2010-10-07 |
Composite Retardation Plate, And Optical Compensation Polarizing Plate And Liquid Crystal Display Device Equipped With Composite Retardation Plate
App 20100171914 - Morishita; Katsuhiko ; et al. | 2010-07-08 |
Liquid Crystal Display Device
App 20100110318 - Ogawa; Katsuya ; et al. | 2010-05-06 |
Thienopyrrole compound and use thereof as HCV polymerase inhibitor
Grant 7,659,263 - Mizojiri , et al. February 9, 2 | 2010-02-09 |
Process For Producing Bend Pipe For Line Pipe And Bend Pipe For Line Pipe
App 20100006190 - Oka; Takahiro | 2010-01-14 |
Liquid Crystal Display Device
App 20090219472 - Fujita; Kenji ; et al. | 2009-09-03 |
5-5-Membered fused heterocyclic compound and use thereof as HCV polymerase inhibitor
App 20090036444 - Mizojiri; Ryo ; et al. | 2009-02-05 |
Image drawing apparatus
Grant 7,460,128 - Oka , et al. December 2, 2 | 2008-12-02 |
Semiconductor chip package
Grant 7,211,883 - Oka , et al. May 1, 2 | 2007-05-01 |
Tetracyclic fused heterocyclic compound and use thereof as HCV polymerase inhibitor
App 20070049593 - Oka; Takahiro ; et al. | 2007-03-01 |
Thienopyrrole compound and use thereof as HCV polymerase inhibitor
App 20060167246 - Mizojiri; Ryo ; et al. | 2006-07-27 |
Semiconductor chip package
Grant 7,075,177 - Oka , et al. July 11, 2 | 2006-07-11 |
Semiconductor package and method of fabricating same
Grant 7,067,357 - Terui , et al. June 27, 2 | 2006-06-27 |
Image drawing apparatus
App 20060092166 - Oka; Takahiro ; et al. | 2006-05-04 |
Semiconductor chip package
App 20050212108 - Oka, Takahiro ; et al. | 2005-09-29 |
Method for fabricating semiconductor apparatus using board frame
Grant 6,948,239 - Oka September 27, 2 | 2005-09-27 |
Semiconductor package and method of fabricating same
Grant 6,831,354 - Terui , et al. December 14, 2 | 2004-12-14 |
Semiconductor package and method of fabricating same
App 20040183175 - Terui, Makoto ; et al. | 2004-09-23 |
Method of manufacturing a semiconductor device having a die pad without a downset
Grant 6,777,264 - Oka August 17, 2 | 2004-08-17 |
Board frame, method for fabricating thereof and method for fabricating semiconductor apparatus
App 20030082855 - Oka, Takahiro | 2003-05-01 |
Method of fabricating semiconductor device
Grant 6,551,906 - Oka April 22, 2 | 2003-04-22 |
Semiconductor package and method of fabricating same
App 20030030133 - Terui, Makoto ; et al. | 2003-02-13 |
Method of manufacturing a semiconductor device having a die pad without a downset
App 20030020177 - Oka, Takahiro | 2003-01-30 |
Semiconductor device
Grant 6,472,729 - Oka October 29, 2 | 2002-10-29 |
Semiconductor chip package
App 20020105067 - Oka, Takahiro ; et al. | 2002-08-08 |
Method of fabricating semiconductor device
App 20020048904 - Oka, Takahiro | 2002-04-25 |
Propylene-ethylene block copolymer compositions and processes for production thereof
Grant 6,355,725 - Terano , et al. March 12, 2 | 2002-03-12 |
Semiconductor device and the method for manufacturing the same
App 20010023994 - Oka, Takahiro | 2001-09-27 |
Propylene-ethylene block copolymer compositions and processes for production thereof
App 20010021732 - Terano, Minoru ; et al. | 2001-09-13 |
Semiconductor Integrated Circuit Device And Package Structure For The Same
App 20010011768 - KOHARA, YOUICHI ; et al. | 2001-08-09 |
Compact resin-sealed semiconductor device
Grant 6,084,300 - Oka July 4, 2 | 2000-07-04 |
Continuous process for preparation of highly rigid propylene-ethylene block copolymers
Grant 5,854,355 - Oka , et al. December 29, 1 | 1998-12-29 |
Highly stiff propylene-ethylene block copolymer composition and a process for producing the same
Grant 5,672,658 - Oka , et al. September 30, 1 | 1997-09-30 |
Process for producing high stiffness polypropylene
Grant 5,532,325 - Oka , et al. July 2, 1 | 1996-07-02 |
Continuous production process of a propylene-ethylene block copolymer
Grant 5,461,115 - Oka October 24, 1 | 1995-10-24 |
Continuous process for producing high molten viscoelastic polypropylene of ethylene-propylene copolymer
Grant 5,140,062 - Chiba , et al. August 18, 1 | 1992-08-18 |
Continuous process for producing high molten viscoelastic polypropylene or ethylene-propylene copolymer
Grant 4,970,280 - Chiba , et al. November 13, 1 | 1990-11-13 |
Process for continuously producing propylene-ethylene block copolymer
Grant 4,771,103 - Chiba , et al. September 13, 1 | 1988-09-13 |
Process for continuously producing a high-melt viscoelastic ethylene-propylene copolymer
Grant 4,760,113 - Chiba , et al. July 26, 1 | 1988-07-26 |
High-rigidity ethylene-propylene copolymer and process for producing same
Grant 4,582,878 - Chiba , et al. April 15, 1 | 1986-04-15 |
Polypropylene resin for high-rigidity molded products
Grant 4,522,994 - Chiba , et al. June 11, 1 | 1985-06-11 |
Ethylene-propylene copolymers for foaming and process for producing the same
Grant 4,510,292 - Chiba , et al. April 9, 1 | 1985-04-09 |
High melt-viscoelastic polypropylene for post-processed sheets and for blow molding
Grant 4,500,682 - Chiba , et al. February 19, 1 | 1985-02-19 |
High-rigidity, high-melt-viscoelasticity polypropylene and process for producing the same
Grant 4,499,247 - Chiba , et al. February 12, 1 | 1985-02-12 |
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