loadpatents
name:-0.46906304359436
name:-0.12079191207886
name:-0.0050868988037109
Oka; Satoshi Patent Filings

Oka; Satoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Oka; Satoshi.The latest application filed is for "method for manufacturing soi wafer".

Company Profile
1.19.14
  • Oka; Satoshi - Annaka N/A JP
  • Oka; Satoshi - Gunma JP
  • Oka, Satoshi - Annaka-shi JP
  • Oka, Satoshi - Tokyo JP
  • Oka; Satoshi - Yao JP
  • Oka; Satoshi - Osaka JP
  • Oka; Satoshi - Matsudo Chiba JA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Silicon epitaxial wafer, method for manufacturing the same, bonded SOI wafer and method for manufacturing the same
Grant 8,823,130 - Kato , et al. September 2, 2
2014-09-02
Method for manufacturing SOI wafer
Grant 8,728,912 - Aga , et al. May 20, 2
2014-05-20
Method for producing bonded wafer
Grant 8,691,665 - Oka , et al. April 8, 2
2014-04-08
Method For Manufacturing Soi Wafer
App 20130316522 - Aga; Hiroji ;   et al.
2013-11-28
Method for manufacturing SOI wafer and SOI wafer
Grant 8,497,187 - Oka , et al. July 30, 2
2013-07-30
Method For Manufacturing Bonded Wafer
App 20130102126 - Aga; Hiroji ;   et al.
2013-04-25
Method for manufacturing bonded wafer
Grant 8,389,382 - Oka , et al. March 5, 2
2013-03-05
Silicon Epitaxial Wafer, Method For Manufacturing The Same, Bonded Soi Wafer And Method For Manufacturing The Same
App 20120326268 - Kato; Masahiro ;   et al.
2012-12-27
Method For Producing Bonded Wafer
App 20120244679 - Oka; Satoshi ;   et al.
2012-09-27
Method for producing semiconductor substrate
Grant 8,076,223 - Oka , et al. December 13, 2
2011-12-13
Method For Manufacturing Bonded Wafer
App 20110237049 - Oka; Satoshi ;   et al.
2011-09-29
Method For Manufacturing Soi Wafer And Soi Wafer
App 20110117727 - Oka; Satoshi ;   et al.
2011-05-19
Method for producing SOI substrate
Grant 7,838,388 - Oka , et al. November 23, 2
2010-11-23
Manufacturing Method Of Strained Si Substrate
App 20100003803 - Oka; Satoshi ;   et al.
2010-01-07
Method For Producing Semiconductor Substrate
App 20090305485 - Oka; Satoshi ;   et al.
2009-12-10
Method for producing SOl substrate
App 20090258474 - Oka; Satoshi ;   et al.
2009-10-15
Fabrication method of semiconductor wafer
Grant 7,029,977 - Kishimoto , et al. April 18, 2
2006-04-18
Method for forming silicon epitaxial layer
Grant 7,008,881 - Tamura , et al. March 7, 2
2006-03-07
Fabrication method of semiconductor wafer
App 20040185665 - Kishimoto, Daisuke ;   et al.
2004-09-23
Method for forming silicon epitaxial layer
App 20040175959 - Tamura, Akitake ;   et al.
2004-09-09
Temperature-detecting element
App 20010022803 - Suzuki, Yoshihiro ;   et al.
2001-09-20
Method for producing a silicon single crystal wafer and a silicon single crystal wafer
Grant 6,139,625 - Tamatsuka , et al. October 31, 2
2000-10-31
Combined power supply adapter and converter for a digital audio tape recorder
Grant D331,385 - Oka December 1, 1
1992-12-01
Combined car-mount unit and power supply adapter for a digital audio tape recorder
Grant D327,868 - Oka July 14, 1
1992-07-14
Process for making identification cards
Grant 3,930,924 - Oka , et al. January 6, 1
1976-01-06
Identification cards and method for making the same
Grant 3,897,964 - Oka , et al. August 5, 1
1975-08-05

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