Oka; Mihir A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Oka; Mihir A..The latest application filed is for "sintered solder for fine pitch first-level interconnect (fli) applications".

Company Profile

5.8.13

Oka; Mihir A. - Chandler AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Apparatus and method for mitigating surface imperfections on die backside film using fluorocarbon material Grant 10,546,823 - Pathangey , et al. Ja	2020-01-28
Sintered solder for fine pitch first-level interconnect (FLI) applications Grant 10,515,914 - Oka , et al. Dec	2019-12-24
Sintered Solder For Fine Pitch First-level Interconnect (fli) Applications App 20190157225 - OKA; Mihir A. ; et al.	2019-05-23
Sintered solder for fine pitch first-level interconnect (FLI) applications Grant 10,224,299 - Oka , et al.	2019-03-05
Apparatus And Method For Mitigating Surface Imperfections On Die Backside Film App 20190067213 - Pathangey; Balu ; et al.	2019-02-28
Sintered Solder For Fine Pitch First-level Interconnect (fli) Applications App 20180190604 - OKA; Mihir A. ; et al.	2018-07-05
Laser die backside film removal for integrated circuit (IC) packaging Grant 9,859,248 - Faruqui , et al. January 2, 2	2018-01-02
Dry-removable Protective Coatings App 20170033069 - Oka; Mihir A. ; et al.	2017-02-02
DBF film as a thermal interface material Grant 9,530,718 - Arora , et al. December 27, 2	2016-12-27
Laser Die Backside Film Removal For Integrated Circuit (ic) Packaging App 20160307869 - Faruqui; Danish ; et al.	2016-10-20
Dry-removable protective coatings Grant 9,472,517 - Oka , et al. October 18, 2	2016-10-18
Dry-removable Protective Coatings App 20150270235 - Oka; Mihir A. ; et al.	2015-09-24
Laser Die Backside Film Removal For Integrated Circuit (ic) Packaging App 20140264951 - Faruqui; Danish ; et al.	2014-09-18
Methods To Improve Laser Mark Contrast On Die Backside Film In Embedded Die Packages App 20140175657 - Oka; Mihir A. ; et al.	2014-06-26
Dbf Film As A Thermal Interface Material App 20140177194 - Arora; Hitesh ; et al.	2014-06-26

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