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Patent applications and USPTO patent grants for Ok; Tae Jun.The latest application filed is for "aromatic liquid-crystalline polyester amide copolymer, prepreg including the same, prepreg laminate including the prepreg, metal film laminate including the prepreg, and printed wiring board including the prepreg".
Patent | Date |
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Thermosetting composition and printed circuit board using the same Grant 8,765,012 - Jung , et al. July 1, 2 | 2014-07-01 |
Liquid crystal polyester resin composition and printed circuit board using the same Grant 7,887,887 - Cho , et al. February 15, 2 | 2011-02-15 |
Aromatic Liquid-crystalline Polyester Amide Copolymer, Prepreg Including The Same, Prepreg Laminate Including The Prepreg, Metal Film Laminate Including The Prepreg, And Printed Wiring Board Including The Prepreg App 20100203326 - OK; Tae Jun | 2010-08-12 |
Thermosetting Composition And Printed Circuit Board Using The Same App 20100124037 - JUNG; Myung Sup ;   et al. | 2010-05-20 |
Method of Preparing Wholly Aromatic Polyester App 20090212451 - Kim; Mahn Jong ;   et al. | 2009-08-27 |
Liquid Crystal Polyester Resin Composition And Printed Circuit Board Using The Same App 20090111949 - CHO; Chung Kun ;   et al. | 2009-04-30 |
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