OJEDA; Oscar

Patent Applications and Registrations

Patent applications and USPTO patent grants for OJEDA; Oscar.The latest application filed is for "via structures having tapered profiles for embedded interconnect bridge substrates".

Company Profile

8.4.10

OJEDA; Oscar - Chandler AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Via Structures Having Tapered Profiles For Embedded Interconnect Bridge Substrates App 20220285278 - ECTON; Jeremy D. ; et al.	2022-09-08
Via structures having tapered profiles for embedded interconnect bridge substrates Grant 11,373,951 - Ecton , et al. June 28, 2	2022-06-28
Multi-step Isotropic Etch Patterning Of Thick Copper Layers For Forming High Aspect-ratio Conductors App 20220199427 - Fadayomi; Oladeji ; et al.	2022-06-23
Method, Device And System For Providing Etched Metallization Structures App 20210289638 - Ecton; Jeremy ; et al.	2021-09-16
Conductive Route Patterning For Electronic Substrates App 20210280463 - Ecton; Jeremy ; et al.	2021-09-09
Method, device and system for providing etched metallization structures Grant 11,116,084 - Ecton , et al. September 7, 2	2021-09-07
Method for making a flexible wearable circuit Grant 10,798,817 - Aleksov , et al. October 6, 2	2020-10-06
Subtractive Etch Resolution Implementing A Functional Thin Metal Resist App 20200258800 - A1	2020-08-13
Method, Device And System For Providing Etched Metallization Structures App 20200236795 - Ecton; Jeremy ; et al.	2020-07-23
Enhanced etch anisotropy using nanoparticles as banking agents in the presence or absence of a magnetic or electrical field Grant 10,515,824 - Ecton , et al. Dec	2019-12-24
Alignment Via-trace Structures App 20190304890 - Ecton; Jeremy ; et al.	2019-10-03
Via Structures Having Tapered Profiles For Embedded Interconnect Bridge Substrates App 20190304912 - Ecton; Jeremy D. ; et al.	2019-10-03
Enhanced Etch Anisotropy Using Nanoparticles As Banking Agents In The Presence Or Absence Of A Magnetic Or Electrical Field App 20190214272 - ECTON; Jeremy ; et al.	2019-07-11
Multi-layer Flexible/stretchable Electronic Package For Advanced Wearable Electronics App 20180376585 - Aleksov; Aleksandar ; et al.	2018-12-27

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