Oishi; Tetsuji
Patent Applications and Registrations
Patent applications and USPTO patent grants for Oishi; Tetsuji.The latest application filed is for "method for filling blind via holes".
- Oishi; Tetsuji - Shizuoka JP
- Oishi, Tetsuji - Chofu-shi JP
- Oishi; Tetsuji - Shizuoka-Ken JP
- OISHI, TETSUJI - SHIMADA-SHI JP
| Patent | Date |
|---|---|
| Substrate treatment apparatus Grant 6,955,178 - Kuzumoto , et al. October 18, 2 | 2005-10-18 |
| Method for filling blind via holes App 20030221969 - Tomisaka, Manabu ; et al. | 2003-12-04 |
| Wafer cleaning device and tray for use in wafer cleaning device Grant 6,616,774 - Sonoda , et al. September 9, 2 | 2003-09-09 |
| Substrate treatment method Grant 6,616,773 - Kuzumoto , et al. September 9, 2 | 2003-09-09 |
| Plating device and plating method App 20030051995 - Nobata, Hirotaka ; et al. | 2003-03-20 |
| Wafer cleaning device and tray for use in wafer cleaning device App 20020066472 - Sonoda, Haruki ; et al. | 2002-06-06 |
| Wafer Cleaning Device And Tray For Use In Wafer Cleaning Device App 20010047817 - SONODA, HARUKI ; et al. | 2001-12-06 |
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