Oishi; Kunio

Patent Applications and Registrations

Patent applications and USPTO patent grants for Oishi; Kunio.The latest application filed is for "scheduler, substrate processing apparatus, and substrate conveyance method".

Company Profile

6.10.15

Oishi; Kunio - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Substrate processing apparatus and storage medium having program stored therein Grant 11,436,392 - Ishii , et al. September 6, 2	2022-09-06
Scheduler, substrate processing apparatus, and substrate conveyance method Grant 11,099,546 - Nonobe , et al. August 24, 2	2021-08-24
Plating system, a plating system control method, and a storage medium containing a program for causing a computer to execute the plating system control method Grant 11,098,414 - Mitsuya , et al. August 24, 2	2021-08-24
Scheduler, Substrate Processing Apparatus, And Substrate Conveyance Method App 20210011462 - Nonobe; Koji ; et al.	2021-01-14
Scheduler, substrate processing apparatus, and substrate conveyance method Grant 10,824,138 - Nonobe , et al. November 3, 2	2020-11-03
Scheduler, substrate processing apparatus, and substrate conveyance method Grant 10,824,135 - Nonobe , et al. November 3, 2	2020-11-03
Substrate-holder Inspection Apparatus, Plating Apparatus Including The Same, And Appearance Inspection Apparatus App 20200255968 - MUKAIYAMA; Yoshitaka ; et al.	2020-08-13
Method Of Constructing Prediction Model That Predicts Number Of Plateable Substrates, Method Of Constructing Selection Model For App 20200193294 - Oishi; Kunio ; et al.	2020-06-18
Plating System, A Plating System Control Method, And A Storage Medium Containing A Program For Causing A Computer To Execute The App 20200056301 - Mitsuya; Takashi ; et al.	2020-02-20
Plating system, a plating system control method, and a storage medium containing a program for causing a computer to execute the plating system control method Grant 10,501,862 - Mitsuya , et al. Dec	2019-12-10
Scheduler, Substrate Processing Apparatus, And Substrate Conveyance Method App 20190271970 - NONOBE; Koji ; et al.	2019-09-05
Substrate Processing Control System, Substrate Processing Control Method, And Program App 20190240799 - TAKEDA; Koichi ; et al.	2019-08-08
Substrate Processing Apparatus And Storage Medium Having Program Stored Therein App 20180336301 - ISHII; Yu ; et al.	2018-11-22
Scheduler, Substrate Processing Apparatus, And Substrate Conveyance Method App 20180203434 - NONOBE; Koji ; et al.	2018-07-19
Plating System, A Plating System Control Method, And A Storage Medium Containing A Program For Causing A Computer To Execute The Plating System Control Method App 20180038008 - MITSUYA; Takashi ; et al.	2018-02-08
Method Of Operating An Electroless Plating Apparatus App 20160130702 - NAKAGAWA; Yoichi ; et al.	2016-05-12
Scheduler, substrate processing apparatus, and method of transferring substrates in substrate processing apparatus Grant 8,655,472 - Koizumi , et al. February 18, 2	2014-02-18
Polishing apparatus and polishing method Grant 8,078,306 - Nakao , et al. December 13, 2	2011-12-13
Scheduler, Substrate Processing Apparatus, And Method Of Transferring Substrates In Substrate Processing Apparatus App 20110172800 - KOIZUMI; Ryuya ; et al.	2011-07-14
Substrate Processing Method And Substrate Processing Apparatus App 20100255757 - SHIGETA; Atsushi ; et al.	2010-10-07
Substrate processing method and substrate processing apparatus Grant 7,767,472 - Shigeta , et al. August 3, 2	2010-08-03
Polishing apparatus and polishing method App 20090111358 - Nakao; Hidetaka ; et al.	2009-04-30
Substrate processing method and substrate processing apparatus App 20070287364 - Shigeta; Atsushi ; et al.	2007-12-13
Substrate processing method and substrate processing apparatus App 20060019417 - Shigeta; Atsushi ; et al.	2006-01-26

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