Oishi; Hideo
Patent Applications and Registrations
Patent applications and USPTO patent grants for Oishi; Hideo.The latest application filed is for "semiconductor wafer test system".
- Oishi; Hideo - Osaka JP
- Oishi; Hideo - Tokyo JP
| Patent | Date |
|---|---|
| Semiconductor wafer test system Grant 7,355,266 - Oishi April 8, 2 | 2008-04-08 |
| Semiconductor wafer test system App 20070077667 - Oishi; Hideo | 2007-04-05 |
| Semiconductor wafer test system Grant 7,151,003 - Oishi December 19, 2 | 2006-12-19 |
| Semiconductor wafer test system App 20050099854 - Oishi, Hideo | 2005-05-12 |
| Input/output circuit of semiconductor integrated circuit Grant 6,812,766 - Oishi , et al. November 2, 2 | 2004-11-02 |
| Input/output circuit of semiconductor integrated circuit App 20040207457 - Oishi, Hideo ; et al. | 2004-10-21 |
| Semiconductor wafer test system Grant 6,603,316 - Oishi August 5, 2 | 2003-08-05 |
| Input/output circuit of semiconductor integrated circuit App 20020175734 - Oishi, Hideo ; et al. | 2002-11-28 |
| Semiconductor wafer test system App 20020005723 - Oishi, Hideo | 2002-01-17 |
| Method of distributing and transporting powdered or granular material Grant 4,529,336 - Shinozaki , et al. July 16, 1 | 1985-07-16 |
| Fermentation Process For The Production Of L-ornithine Grant 3,668,072 - Ando , et al. June 6, 1 | 1972-06-06 |
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