Oikawa; Wataru
Patent Applications and Registrations
Patent applications and USPTO patent grants for Oikawa; Wataru.The latest application filed is for "injection mold assembly".
- Oikawa; Wataru - Tochigi JP
| Patent | Date |
|---|---|
| Injection mold assembly Grant 7,648,117 - Oikawa , et al. January 19, 2 | 2010-01-19 |
| Method and apparatus for partially plating work surfaces Grant 7,402,231 - Oikawa , et al. July 22, 2 | 2008-07-22 |
| Injection Mold Assembly App 20080145472 - OIKAWA; Wataru ; et al. | 2008-06-19 |
| Resistance welding method of different kinds of materials, and resistance welding member of aluminum alloy material and different kind of material App 20050218121 - Hayashi, Noboru ; et al. | 2005-10-06 |
| Method and apparatus for partially plating work surfaces App 20050056541 - Oikawa, Wataru ; et al. | 2005-03-17 |
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