loadpatents
name:-0.036014080047607
name:-0.028917074203491
name:-0.0074598789215088
Oikawa; Ryuichi Patent Filings

Oikawa; Ryuichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Oikawa; Ryuichi.The latest application filed is for "semiconductor device and electronic device".

Company Profile
6.25.28
  • Oikawa; Ryuichi - Tokyo JP
  • Oikawa; Ryuichi - Kawasaki JP
  • Oikawa; Ryuichi - Kanagawa JP
  • Oikawa; Ryuichi - Kawasaki-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor device
Grant 11,437,341 - Oikawa September 6, 2
2022-09-06
Semiconductor device
Grant 11,431,378 - Oikawa August 30, 2
2022-08-30
Semiconductor Device And Electronic Device
App 20220165672 - OIKAWA; Ryuichi
2022-05-26
Semiconductor device with improved signal transmission characteristics
Grant 11,177,235 - Oikawa November 16, 2
2021-11-16
Semiconductor device
Grant 11,171,083 - Oikawa November 9, 2
2021-11-09
Semiconductor device
Grant 11,171,112 - Oikawa November 9, 2
2021-11-09
Semiconductor Device
App 20210233886 - OIKAWA; Ryuichi
2021-07-29
Semiconductor Device
App 20210159166 - OIKAWA; Ryuichi
2021-05-27
Electronic device and method of manufacturing the same
Grant 10,809,470 - Tsuchiyama , et al. October 20, 2
2020-10-20
Semiconductor Device
App 20200235068 - OIKAWA; Ryuichi
2020-07-23
Semiconductor Device
App 20200144177 - OIKAWA; Ryuichi
2020-05-07
Semiconductor Device
App 20200112335 - OIKAWA; Ryuichi
2020-04-09
Electronic Device And Method Of Manufacturing The Same
App 20190377143 - TSUCHIYAMA; Kazuaki ;   et al.
2019-12-12
Semiconductor device
Grant 10,403,569 - Oikawa Sep
2019-09-03
Semiconductor Device
App 20190229088 - OIKAWA; Ryuichi
2019-07-25
Semiconductor device
Grant 10,347,552 - Oikawa , et al. July 9, 2
2019-07-09
Semiconductor Device
App 20180374787 - OIKAWA; Ryuichi
2018-12-27
Semiconductor Device
App 20180367186 - OIKAWA; Ryuichi
2018-12-20
Semiconductor device
Grant 10,090,881 - Oikawa October 2, 2
2018-10-02
Semiconductor device
Grant 10,027,311 - Oikawa , et al. July 17, 2
2018-07-17
Semiconductor Device
App 20180183411 - OIKAWA; Ryuichi ;   et al.
2018-06-28
Semiconductor Device
App 20180151460 - OIKAWA; Ryuichi ;   et al.
2018-05-31
Semiconductor device
Grant 9,917,026 - Oikawa , et al. March 13, 2
2018-03-13
Semiconductor Device
App 20170263693 - OIKAWA; Ryuichi
2017-09-14
Semiconductor Device
App 20170213776 - OIKAWA; Ryuichi ;   et al.
2017-07-27
Semiconductor Device
App 20170141812 - OIKAWA; Ryuichi
2017-05-18
Semiconductor device
Grant 9,620,447 - Kariyazaki , et al. April 11, 2
2017-04-11
Semiconductor device and circuit board
Grant 9,560,762 - Oikawa January 31, 2
2017-01-31
Semiconductor device
Grant 9,461,016 - Kariyazaki , et al. October 4, 2
2016-10-04
Semiconductor Device
App 20160218083 - KARIYAZAKI; Shuuichi ;   et al.
2016-07-28
Semiconductor Device
App 20160190049 - KARIYAZAKI; Shuuichi ;   et al.
2016-06-30
Semiconductor device with semiconductor chip and wiring layers
Grant 9,312,216 - Kariyazaki , et al. April 12, 2
2016-04-12
Semiconductor Device
App 20150214142 - KARIYAZAKI; Shuuichi ;   et al.
2015-07-30
Semiconductor device and interconnect substrate
Grant 9,035,450 - Kariyazaki , et al. May 19, 2
2015-05-19
Semiconductor Device And Interconnect Substrate
App 20150123258 - Kariyazaki; Shuuichi ;   et al.
2015-05-07
Interconnection structure
Grant 9,006,910 - Oikawa April 14, 2
2015-04-14
Semiconductor Device And Interconnect Substrate
App 20140300003 - KARIYAZAKI; SHUUICHI ;   et al.
2014-10-09
Semiconductor Device And Circuit Board
App 20140104802 - Oikawa; Ryuichi
2014-04-17
Interconnection structure and its design method
Grant 8,373,263 - Oikawa February 12, 2
2013-02-12
Impedance measurement method and impedance measurement device
Grant 8,253,421 - Oikawa August 28, 2
2012-08-28
Design method of semiconductor package substrate to cancel a reflected wave
Grant 8,104,013 - Oikawa January 24, 2
2012-01-24
Interconnection Structure
App 20110180942 - OIKAWA; Ryuichi
2011-07-28
Interconnection Structure And Its Design Method
App 20110180940 - OIKAWA; Ryuichi
2011-07-28
Package substrate and semiconductor apparatus
App 20110133340 - OIKAWA; Ryuichi
2011-06-09
Impedance measurement method and impedance measurement device
App 20100171517 - Oikawa; Ryuichi
2010-07-08
Design method of semiconductor package substrate
App 20090283892 - Oikawa; Ryuichi
2009-11-19
Package substrate for a semiconductor device having thermoplastic resin layers and conductive patterns
Grant 7,378,745 - Hayashi , et al. May 27, 2
2008-05-27
Impedance measuring apparatus of package substrate and method for the same
Grant 7,292,054 - Oikawa November 6, 2
2007-11-06
Impedance measuring apparatus of package substrate and method for the same
App 20060220663 - Oikawa; Ryuichi
2006-10-05
Package substrate for a semiconductor device, a fabrication method for same, and a semiconductor device
App 20060044735 - Hayashi; Akimori ;   et al.
2006-03-02
Semiconductor memory device having an internal amplification function
Grant 5,675,160 - Oikawa October 7, 1
1997-10-07

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