loadpatents
Patent applications and USPTO patent grants for Oikawa; Ryuichi.The latest application filed is for "semiconductor device and electronic device".
Patent | Date |
---|---|
Semiconductor device Grant 11,437,341 - Oikawa September 6, 2 | 2022-09-06 |
Semiconductor device Grant 11,431,378 - Oikawa August 30, 2 | 2022-08-30 |
Semiconductor Device And Electronic Device App 20220165672 - OIKAWA; Ryuichi | 2022-05-26 |
Semiconductor device with improved signal transmission characteristics Grant 11,177,235 - Oikawa November 16, 2 | 2021-11-16 |
Semiconductor device Grant 11,171,083 - Oikawa November 9, 2 | 2021-11-09 |
Semiconductor device Grant 11,171,112 - Oikawa November 9, 2 | 2021-11-09 |
Semiconductor Device App 20210233886 - OIKAWA; Ryuichi | 2021-07-29 |
Semiconductor Device App 20210159166 - OIKAWA; Ryuichi | 2021-05-27 |
Electronic device and method of manufacturing the same Grant 10,809,470 - Tsuchiyama , et al. October 20, 2 | 2020-10-20 |
Semiconductor Device App 20200235068 - OIKAWA; Ryuichi | 2020-07-23 |
Semiconductor Device App 20200144177 - OIKAWA; Ryuichi | 2020-05-07 |
Semiconductor Device App 20200112335 - OIKAWA; Ryuichi | 2020-04-09 |
Electronic Device And Method Of Manufacturing The Same App 20190377143 - TSUCHIYAMA; Kazuaki ;   et al. | 2019-12-12 |
Semiconductor device Grant 10,403,569 - Oikawa Sep | 2019-09-03 |
Semiconductor Device App 20190229088 - OIKAWA; Ryuichi | 2019-07-25 |
Semiconductor device Grant 10,347,552 - Oikawa , et al. July 9, 2 | 2019-07-09 |
Semiconductor Device App 20180374787 - OIKAWA; Ryuichi | 2018-12-27 |
Semiconductor Device App 20180367186 - OIKAWA; Ryuichi | 2018-12-20 |
Semiconductor device Grant 10,090,881 - Oikawa October 2, 2 | 2018-10-02 |
Semiconductor device Grant 10,027,311 - Oikawa , et al. July 17, 2 | 2018-07-17 |
Semiconductor Device App 20180183411 - OIKAWA; Ryuichi ;   et al. | 2018-06-28 |
Semiconductor Device App 20180151460 - OIKAWA; Ryuichi ;   et al. | 2018-05-31 |
Semiconductor device Grant 9,917,026 - Oikawa , et al. March 13, 2 | 2018-03-13 |
Semiconductor Device App 20170263693 - OIKAWA; Ryuichi | 2017-09-14 |
Semiconductor Device App 20170213776 - OIKAWA; Ryuichi ;   et al. | 2017-07-27 |
Semiconductor Device App 20170141812 - OIKAWA; Ryuichi | 2017-05-18 |
Semiconductor device Grant 9,620,447 - Kariyazaki , et al. April 11, 2 | 2017-04-11 |
Semiconductor device and circuit board Grant 9,560,762 - Oikawa January 31, 2 | 2017-01-31 |
Semiconductor device Grant 9,461,016 - Kariyazaki , et al. October 4, 2 | 2016-10-04 |
Semiconductor Device App 20160218083 - KARIYAZAKI; Shuuichi ;   et al. | 2016-07-28 |
Semiconductor Device App 20160190049 - KARIYAZAKI; Shuuichi ;   et al. | 2016-06-30 |
Semiconductor device with semiconductor chip and wiring layers Grant 9,312,216 - Kariyazaki , et al. April 12, 2 | 2016-04-12 |
Semiconductor Device App 20150214142 - KARIYAZAKI; Shuuichi ;   et al. | 2015-07-30 |
Semiconductor device and interconnect substrate Grant 9,035,450 - Kariyazaki , et al. May 19, 2 | 2015-05-19 |
Semiconductor Device And Interconnect Substrate App 20150123258 - Kariyazaki; Shuuichi ;   et al. | 2015-05-07 |
Interconnection structure Grant 9,006,910 - Oikawa April 14, 2 | 2015-04-14 |
Semiconductor Device And Interconnect Substrate App 20140300003 - KARIYAZAKI; SHUUICHI ;   et al. | 2014-10-09 |
Semiconductor Device And Circuit Board App 20140104802 - Oikawa; Ryuichi | 2014-04-17 |
Interconnection structure and its design method Grant 8,373,263 - Oikawa February 12, 2 | 2013-02-12 |
Impedance measurement method and impedance measurement device Grant 8,253,421 - Oikawa August 28, 2 | 2012-08-28 |
Design method of semiconductor package substrate to cancel a reflected wave Grant 8,104,013 - Oikawa January 24, 2 | 2012-01-24 |
Interconnection Structure App 20110180942 - OIKAWA; Ryuichi | 2011-07-28 |
Interconnection Structure And Its Design Method App 20110180940 - OIKAWA; Ryuichi | 2011-07-28 |
Package substrate and semiconductor apparatus App 20110133340 - OIKAWA; Ryuichi | 2011-06-09 |
Impedance measurement method and impedance measurement device App 20100171517 - Oikawa; Ryuichi | 2010-07-08 |
Design method of semiconductor package substrate App 20090283892 - Oikawa; Ryuichi | 2009-11-19 |
Package substrate for a semiconductor device having thermoplastic resin layers and conductive patterns Grant 7,378,745 - Hayashi , et al. May 27, 2 | 2008-05-27 |
Impedance measuring apparatus of package substrate and method for the same Grant 7,292,054 - Oikawa November 6, 2 | 2007-11-06 |
Impedance measuring apparatus of package substrate and method for the same App 20060220663 - Oikawa; Ryuichi | 2006-10-05 |
Package substrate for a semiconductor device, a fabrication method for same, and a semiconductor device App 20060044735 - Hayashi; Akimori ;   et al. | 2006-03-02 |
Semiconductor memory device having an internal amplification function Grant 5,675,160 - Oikawa October 7, 1 | 1997-10-07 |
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