Oikawa; Hideo
Patent Applications and Registrations
Patent applications and USPTO patent grants for Oikawa; Hideo.The latest application filed is for "method of connecting wirings through connection hole".
- Oikawa; Hideo - Koganei JP
- Oikawa; Hideo - Iwakuni JP
- Oikawa; Hideo - Atsugi JP
| Patent | Date |
|---|---|
| Method of connecting wirings through connection hole Grant 5,320,979 - Hashimoto , et al. June 14, 1 | 1994-06-14 |
| Sizing composition and sizing method Grant 5,013,775 - Oikawa , et al. May 7, 1 | 1991-05-07 |
| High-purity metal and metal silicide target for LSI electrodes Grant 4,770,948 - Oikawa , et al. * September 13, 1 | 1988-09-13 |
| Thin film forming apparatus and method Grant 4,732,761 - Machida , et al. March 22, 1 | 1988-03-22 |
| Process for producing high-purity metal targets for LSI electrodes Grant 4,619,695 - Oikawa , et al. October 28, 1 | 1986-10-28 |
| Semiconductor device and process for manufacturing the same Grant 4,557,036 - Kyuragi , et al. December 10, 1 | 1985-12-10 |
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