loadpatents
name:-0.3627769947052
name:-0.012923955917358
name:-0.00054478645324707
OIKAWA; Akira Patent Filings

OIKAWA; Akira

Patent Applications and Registrations

Patent applications and USPTO patent grants for OIKAWA; Akira.The latest application filed is for "electronic component and method for manufacturing the same".

Company Profile
0.13.13
  • OIKAWA; Akira - Higashiomi-shi JP
  • Oikawa; Akira - Kyoto JP
  • OIKAWA; Akira - Kyoto-shi Kyoto
  • Oikawa; Akira - Kirishima N/A JP
  • Oikawa; Akira - Tokyo JP
  • Oikawa; Akira - Kirishima-shi JP
  • Oikawa; Akira - Kokubu JP
  • Oikawa; Akira - Kokubu-shi JP
  • Oikawa; Akira - Kawasaki JP
  • Oikawa; Akira - Machida JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Electronic Component And Method For Manufacturing The Same
App 20220190805 - OIKAWA; Akira ;   et al.
2022-06-16
Electronic Component And Method For Manufacturing The Same
App 20220123713 - KITANISHI; Sinichiro ;   et al.
2022-04-21
Acoustic wave device and acoustic wave module
Grant 10,193,528 - Oikawa Ja
2019-01-29
Electronic component
Grant 9,773,964 - Oikawa , et al. September 26, 2
2017-09-26
Acoustic Wave Device And Acuoustic Wave Module
App 20160248399 - OIKAWA; Akira
2016-08-25
Electronic device
Grant 9,386,703 - Oikawa July 5, 2
2016-07-05
Spherical stylus
Grant D748,095 - Oikawa January 26, 2
2016-01-26
Electronic Device
App 20140369013 - Oikawa; Akira
2014-12-18
Electronic Component
App 20140361663 - Oikawa; Akira ;   et al.
2014-12-11
Multilayer circuit board with resin bases and separators
Grant 8,787,030 - Oikawa July 22, 2
2014-07-22
Multilayer Circuit Board And Method Of Manufacturing The Same
App 20110211321 - Oikawa; Akira
2011-09-01
Flexible Wiring Unit And Electronic Apparatus
App 20110024162 - Oikawa; Akira
2011-02-03
Circuit Board
App 20110000702 - Oikawa; Akira
2011-01-06
Flexible Wiring Unit And Electronic Device
App 20100172058 - Oikawa; Akira
2010-07-08
Method for manufacturing surface acoustic wave device
Grant 7,513,022 - Shimada , et al. April 7, 2
2009-04-07
Pressure sensor device with surface acoustic wave elements
Grant 7,353,710 - Oikawa , et al. April 8, 2
2008-04-08
Pressure sensor device
App 20070107522 - Oikawa; Akira ;   et al.
2007-05-17
Surface acoustic wave device and method for manufacturing same
Grant 7,154,206 - Shimada , et al. December 26, 2
2006-12-26
Method for manufacturing surface acoustic wave device
App 20060220500 - Shimada; Mitsutaka ;   et al.
2006-10-05
Surface acoustic wave device and method for manufacturing same
App 20040113215 - Shimada, Mitsutaka ;   et al.
2004-06-17
Method of making resist patterns
Grant 6,127,098 - Nakagawa , et al. October 3, 2
2000-10-03
Polysilphenylenesiloxane, production process thereof, and resist material and semiconductor device formed thereof
Grant 5,484,687 - Watanabe , et al. January 16, 1
1996-01-16
Polysilphenylenesiloxane, production process thereof, and resist material and semiconductor device formed thereof
Grant 5,240,813 - Watanabe , et al. August 31, 1
1993-08-31

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