Oi; Sotaro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Oi; Sotaro.The latest application filed is for "power-module substrate with heat-sink".

Company Profile

5.20.20

Oi; Sotaro - Saitama JP
Oi; Sotaro - Suntogun JP
Oi; Sotaro - Saitama-shi JP
Oi; Sotaro - Kitamoto JP
Oi; Sotaro - Kitamoto-shi JP
Oi; Sotaro - Saitama-ken JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Heat sink-attached power module substrate board and power module Grant 11,355,415 - Oohiraki , et al. June 7, 2	2022-06-07
Electronic-component-mounted module design to reduce linear expansion coefficient mismatches Grant 11,315,868 - Oohiraki , et al. April 26, 2	2022-04-26
Power-module substrate with heat-sink Grant 11,302,602 - Yumoto , et al. April 12, 2	2022-04-12
Power-module Substrate With Heat-sink App 20210296204 - Yumoto; Ryohei ; et al.	2021-09-23
Heat Sink-attached Power Module Substrate Board And Power Module App 20210074607 - Oohiraki; Tomoya ; et al.	2021-03-11
Manufacturing Method Of Electronic-component-mounted Module App 20210020456 - Oohiraki; Tomoya ; et al.	2021-01-21
Electronic-component-mounted Module App 20210005544 - Oohiraki; Tomoya ; et al.	2021-01-07
Joined body manufacturing method, multilayer joined body manufacturing method, power-module substrate manufacturing method, heat sink equipped power-module substrate manufacturing method, and laminated body manufacturing device Grant 10,607,915 - Oohiraki , et al.	2020-03-31
Power-module Substrate With Heat-sink App 20200027815 - Yumoto; Ryohei ; et al.	2020-01-23
Heat-sink-attached power-module substrate and power module Grant 10,453,772 - Oohiraki , et al. Oc	2019-10-22
Thermoelectric Conversion Module And Thermoelectric Conversion Device App 20190058101 - Oi; Sotaro ; et al.	2019-02-21
Power-module substrate with cooler and method of producing the same Grant 10,211,068 - Oi , et al. Feb	2019-02-19
Heat-sink-attached Power-module Substrate And Power Module App 20180301391 - Oohiraki; Tomoya ; et al.	2018-10-18
Power-module substrate unit and power module Grant 10,068,829 - Oi , et al. September 4, 2	2018-09-04
Method of manufacturing power-module substrate with heat-sink Grant 10,032,648 - Oohiraki , et al. July 24, 2	2018-07-24
Carrier transport system Grant 9,897,380 - Matsuura , et al. February 20, 2	2018-02-20
Power-module substrate unit and power module Grant 9,837,363 - Oi , et al. December 5, 2	2017-12-05
Power-module Substrate With Cooler And Method Of Producing The Same App 20170309499 - Oi; Sotaro ; et al.	2017-10-26
Producing Method Of Power-module Substrate App 20170229320 - Oohiraki; Tomoya ; et al.	2017-08-10
Apparatus and method for producing (metal plate)-(ceramic board) laminated assembly, and apparatus and method for producing power-module substrate Grant 9,725,367 - Oi , et al. August 8, 2	2017-08-08
Power-module Substrate Unit And Power Module App 20170154855 - OI; Sotaro ; et al.	2017-06-01
Joined Body Manufacturing Method, Multilayer Joined Body Manufacturing Method, Power-module Substrate Manufacturing Method, Heat Sink Equipped Power-module Substrate Manufacturing Method, And Laminated Body Manufacturing Device App 20170141011 - Oohiraki; Tomoya ; et al.	2017-05-18
Power module substrate and power module Grant 9,615,442 - Oi April 4, 2	2017-04-04
Manufacturing method of power-module substrate Grant 9,579,739 - Oohiraki , et al. February 28, 2	2017-02-28
Power-module Substrate Unit And Power Module App 20170053852 - Oi; Sotaro ; et al.	2017-02-23
Power-module Substrate With Heat-sink And Manufacturing Method Thereof App 20160254209 - Oohiraki; Tomoya ; et al.	2016-09-01
Apparatus And Method For Producing (metal Plate)-(ceramic Board) Laminated Assembly, And Apparatus And Method For Producing Power-module Substrate App 20160052830 - OI; Sotaro ; et al.	2016-02-25
Manufacturing Method Of Power-module Substrate App 20160001388 - Oohiraki; Tomoya ; et al.	2016-01-07
Carrier positioning method and carrier transport system Grant 9,103,594 - Matsuura , et al. August 11, 2	2015-08-11
Power-module Substrate And Power Module App 20150223317 - Oi; Sotaro	2015-08-06
Heating furnace and heating method employed by heating furnace Grant 9,033,705 - Matsuura , et al. May 19, 2	2015-05-19
Method of manufacturing power module substrate and power module substrate Grant 9,018,534 - Oi April 28, 2	2015-04-28
Carrier Transport System App 20140011149 - MATSUURA; Masanari ; et al.	2014-01-09
Method Of Manufacturing Power Module Substrate And Power Module Substrate App 20120267149 - Oi; Sotaro	2012-10-25
Cooling method of carrying section and carrier Grant 8,177,050 - Matsuura , et al. May 15, 2	2012-05-15
Carrier Positioning Method And Carrier Transport System App 20110165531 - Matsuura; Masanari ; et al.	2011-07-07
Heating furnace and heating method employed by heating furnace App 20090325116 - Matsuura; Masanari ; et al.	2009-12-31

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