OI; Kiyoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for OI; Kiyoshi.The latest application filed is for "semiconductor device".

Company Profile

1.28.34

OI; Kiyoshi - Nagano-shi JP
Oi; Kiyoshi - Nagano JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Device App 20220028774 - MURAYAMA; Kei ; et al.	2022-01-27
Flow Cell App 20190391069 - Shimizu; Yuichiro ; et al.	2019-12-26
Wiring substrate and semiconductor device Grant 9,997,450 - Oi , et al. June 12, 2	2018-06-12
Wiring substrate, semiconductor device, and method for manufacturing wiring substrate Grant 9,859,201 - Shimizu , et al. January 2, 2	2018-01-02
Wiring Substrate And Semiconductor Device App 20170103942 - OI; KIYOSHI ; et al.	2017-04-13
Wiring substrate, semiconductor device, method of manufacturing wiring substrate, and method of manufacturing semiconductor device Grant 9,622,347 - Oi , et al. April 11, 2	2017-04-11
Semiconductor device and method of manufacturing the same Grant 9,530,744 - Oi , et al. December 27, 2	2016-12-27
Wiring substrate and semiconductor device Grant 9,307,641 - Oi , et al. April 5, 2	2016-04-05
Wiring Substrate, Semiconductor Device, And Method For Manufacturing Wiring Substrate App 20150357276 - SHIMIZU; Noriyoshi ; et al.	2015-12-10
Wiring Substrate And Method For Manufacturing Wiring Substrate App 20150305153 - IMAFUJI; Kei ; et al.	2015-10-22
Semiconductor Device And Method Of Manufacturing The Same App 20150228551 - OI; Kiyoshi ; et al.	2015-08-13
Wiring Substrate, Semiconductor Device, Method Of Manufacturing Wiring Substrate, And Method Of Manufacturing Semiconductor Device App 20150223330 - OI; Kiyoshi ; et al.	2015-08-06
Method of manufacturing semiconductor device Grant 9,048,331 - Oi , et al. June 2, 2	2015-06-02
Method Of Manufacturing Semiconductor Device App 20140170810 - Oi; Kiyoshi ; et al.	2014-06-19
Electronic packaging apparatus and electronic packaging method Grant 8,720,519 - Yamakami , et al. May 13, 2	2014-05-13
Semiconductor device having electronic component in through part, electronic device, and manufacturing method of semiconductor Grant 8,669,653 - Oi March 11, 2	2014-03-11
Wiring board and electronic component device Grant 8,334,461 - Taguchi , et al. December 18, 2	2012-12-18
Manufacturing method of semiconductor device having underfill resin formed without void between semiconductor chip and wiring board Grant 8,138,018 - Oi , et al. March 20, 2	2012-03-20
Electronic Packaging Apparatus And Electronic Packaging Method App 20120043005 - YAMAKAMI; Takatoyo ; et al.	2012-02-23
Module substrate including optical transmission mechanism and method of producing the same Grant 8,111,954 - Koizumi , et al. February 7, 2	2012-02-07
Manufacturing method of semiconductor package Grant 8,017,503 - Oi , et al. September 13, 2	2011-09-13
Package for semiconductor device and method of manufacturing the same Grant 7,963,031 - Koizumi , et al. June 21, 2	2011-06-21
Manufacturing Method Of Semiconductor Package App 20110104886 - OI; Kiyoshi ; et al.	2011-05-05
Stacked package and method for manufacturing the package Grant 7,928,557 - Oi , et al. April 19, 2	2011-04-19
Wiring board and method of manufacturing the same, and electronic component device using the wiring board and method of manufacturing the same Grant 7,859,121 - Sunohara , et al. December 28, 2	2010-12-28
Component For Semiconductor Package And Manufacturing Method Of Component For Semiconductor Package App 20100267208 - Oi; Kiyoshi ; et al.	2010-10-21
Semiconductor Device, Electronic Device, And Manufacturing Method Of Semiconductor Device App 20100244230 - OI; Kiyoshi	2010-09-30
Wiring board and method of manufacturing the same, and electronic component device using the wiring board and method of manufacturing the same App 20100192371 - Sunohara; Masahiro ; et al.	2010-08-05
Semiconductor device Grant 7,768,140 - Oi August 3, 2	2010-08-03
Electronic component built-in substrate and method of manufacturing the same Grant 7,678,681 - Oi March 16, 2	2010-03-16
Method of manufacturing semiconductor device Grant 7,678,612 - Fujii , et al. March 16, 2	2010-03-16
Manufacturing Method Of Semiconductor Device App 20090258460 - Oi; Kiyoshi ; et al.	2009-10-15
Module Substrate Including Optical Tranmission Mechanism And Method Of Producing The Same App 20090245724 - KOIZUMI; Naoyuki ; et al.	2009-10-01
Package For Semiconductor Device And Method Of Manufacturing The Same App 20090151995 - Koizumi; Naoyuki ; et al.	2009-06-18
Wiring Board And Electronic Component Device App 20090141464 - TAGUCHI; Yuichi ; et al.	2009-06-04
Method of manufacturing wiring substrate to which semiconductor chip is mounted Grant 7,536,780 - Shimizu , et al. May 26, 2	2009-05-26
Component For Semiconductor Package And Manufacturing Method Of Component For Semiconductor Package App 20090121341 - Oi; Kiyoshi ; et al.	2009-05-14
Manufacturing Method Of Semiconductor Apparatus And Semiconductor Apparatus App 20090121334 - Oi; Kiyoshi ; et al.	2009-05-14
Semiconductor Device, Manufacturing Method Thereof, And Semiconductor Device Product App 20080303153 - Oi; Kiyoshi ; et al.	2008-12-11
Semiconductor Device App 20080251944 - Oi; Kiyoshi	2008-10-16
Encapsulated electronic part packaging structure Grant 7,414,309 - Oi , et al. August 19, 2	2008-08-19
Capacitor parts Grant 7,403,370 - Oi , et al. July 22, 2	2008-07-22
Stacked Package And Method For Manufacturing The Package App 20080142944 - Oi; Kiyoshi ; et al.	2008-06-19
Method of manufacturing wiring board Grant 7,375,022 - Oi , et al. May 20, 2	2008-05-20
Capacitor device and semiconductor device having the same, and capacitor device manufacturing method Grant 7,358,591 - Horikawa , et al. April 15, 2	2008-04-15
Method of manufacturing semiconductor device App 20080076249 - Fujii; Tomoharu ; et al.	2008-03-27
Method of manufacturing an electronic parts packaging structure Grant 7,319,049 - Oi , et al. January 15, 2	2008-01-15
Electronic component built-in substrate and method of manufacturing the same App 20070262452 - Oi; Kiyoshi	2007-11-15
Method for manufacturing wiring board Grant 7,284,307 - Yamasaki , et al. October 23, 2	2007-10-23
Method of manufacturing electronic part packaging structure Grant 7,229,856 - Oi , et al. June 12, 2	2007-06-12
Manufacturing method of wiring board and manufacturing method of semiconductor device App 20070111387 - Oi; Kiyoshi	2007-05-17
Electronic parts and method of manufacturing electronic parts packaging structure App 20070052086 - Oi; Kiyoshi ; et al.	2007-03-08
Capacitor Parts App 20060197184 - OI; Kiyoshi ; et al.	2006-09-07
Method of manufacturing wiring board App 20060141764 - Oi; Kiyoshi ; et al.	2006-06-29
Method for manufacturing wiring board App 20060130303 - Yamasaki; Tomoo ; et al.	2006-06-22
Method of manufacturing wiring substrate to which semiconductor chip is mounted App 20060131069 - Shimizu; Noriyoshi ; et al.	2006-06-22
Electronic part-containing elements, electronic devices and production methods App 20060017133 - Oi; Kiyoshi ; et al.	2006-01-26
Electronic parts and method of manufacturing electronic parts packaging structure App 20050258447 - Oi, Kiyoshi ; et al.	2005-11-24
Method of manufacturing an electronic parts packaging structure App 20050247665 - Oi, Kiyoshi ; et al.	2005-11-10
Capacitor device and semiconductor device having the same, and capacitor device manufacturing method App 20050199929 - Horikawa, Yasuyoshi ; et al.	2005-09-15

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