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name:-0.013530969619751
name:-0.0094268321990967
name:-0.0016489028930664
Ohyama; Akinori Patent Filings

Ohyama; Akinori

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ohyama; Akinori.The latest application filed is for "laser processing device having preprocessing controller and laser processing method".

Company Profile
1.9.11
  • Ohyama; Akinori - Yamanashi JP
  • Ohyama; Akinori - Minamitsuru-gun N/A JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Laser processing device capable of reducing intensity of reflected laser beam
Grant 10,730,148 - Ohyama , et al.
2020-08-04
Machine learning apparatus, laser machining system and machine learning method
Grant 10,664,767 - Takigawa , et al.
2020-05-26
Machine learning apparatus for learning condition for starting laser machining, laser apparatus, and machine learning method
Grant 10,643,127 - Takigawa , et al.
2020-05-05
Laser processing device having preprocessing controller and laser processing method
Grant 10,456,869 - Mori , et al. Oc
2019-10-29
Laser Processing Device Having Preprocessing Controller And Laser Processing Method
App 20170282300 - Mori; Atsushi ;   et al.
2017-10-05
Laser Processing Device Capable Of Reducing Intensity Of Reflected Laser Beam
App 20170282301 - Ohyama; Akinori ;   et al.
2017-10-05
Machine Learning Apparatus, Laser Machining System And Machine Learning Method
App 20170270434 - Takigawa; Hiroshi ;   et al.
2017-09-21
Machine Learning Apparatus For Learning Condition For Starting Laser Machining, Laser Apparatus, And Machine Learning Method
App 20170220927 - Takigawa; Hiroshi ;   et al.
2017-08-03
Processing information acquisition system in processing machine supplying processing point with energy or material
Grant 9,541,917 - Mori , et al. January 10, 2
2017-01-10
Processing information acquisition system in processing machine supplying processing point with energy or material
Grant 9,535,417 - Mori , et al. January 3, 2
2017-01-03
Processing information acquisition system in processing machine supplying processing point with energy or material
Grant 9,104,194 - Mori , et al. August 11, 2
2015-08-11
Processing Information Acquisition System In Processing Machine Supplying Processing Point With Energy Or Material
App 20150174680 - MORI; Atsushi ;   et al.
2015-06-25
Processing Information Acquisition System In Processing Machine Supplying Processing Point With Energy Or Material
App 20150177739 - MORI; Atsushi ;   et al.
2015-06-25
Processing Information Acquisition System In Processing Machine Supplying Processing Point With Energy Or Material
App 20120035745 - MORI; Atsushi ;   et al.
2012-02-09
Semiconductor laser apparatus
App 20060140238 - Nishikawa; Yuji ;   et al.
2006-06-29
Two-dimensional laser diode array light-emitting device
Grant 6,934,309 - Nishikawa , et al. August 23, 2
2005-08-23
Cooling device for semiconductor component
App 20050141574 - Sakano, Tetsuro ;   et al.
2005-06-30
Semiconductor laser device
App 20040252735 - Sakano, Tetsuro ;   et al.
2004-12-16
Two-dimensional laser diode array light-emitting device
App 20030039278 - Nishikawa, Yuji ;   et al.
2003-02-27

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