loadpatents
Patent applications and USPTO patent grants for Ohura; Yukinobu.The latest application filed is for "protective film agent for laser dicing".
Patent | Date |
---|---|
Protective Film Agent For Laser Dicing App 20220139754 - Ryo; Senichi ;   et al. | 2022-05-05 |
Protective film agent for laser dicing Grant 11,322,383 - Ryo , et al. May 3, 2 | 2022-05-03 |
Protective film forming resin agent and laser processing method Grant 10,858,524 - Ohura , et al. December 8, 2 | 2020-12-08 |
Method of processing wafer Grant 10,811,458 - Oba , et al. October 20, 2 | 2020-10-20 |
Protective Film Agent For Laser Dicing App 20200234994 - RYO; Senichi ;   et al. | 2020-07-23 |
Method Of Processing Wafer App 20190109173 - OBA; Ryugo ;   et al. | 2019-04-11 |
Protective film applying apparatus and protective film applying method Grant 10,086,474 - Ryo , et al. October 2, 2 | 2018-10-02 |
Protective film detecting method Grant 9,976,951 - Ryo , et al. May 22, 2 | 2018-05-22 |
Protective Film Forming Resin Agent And Laser Processing Method App 20180134905 - Ohura; Yukinobu ;   et al. | 2018-05-17 |
Protective Film Applying Apparatus And Protective Film Applying Method App 20170368636 - Ryo; Senichi ;   et al. | 2017-12-28 |
Laser processing method Grant 9,847,257 - Ohura , et al. December 19, 2 | 2017-12-19 |
Wafer processing method Grant 9,748,119 - Ryo , et al. August 29, 2 | 2017-08-29 |
Protective film detecting method for laser processing Grant 9,689,798 - Ryo , et al. June 27, 2 | 2017-06-27 |
Protective Film Detecting Method For Laser Processing App 20170176331 - Ryo; Senichi ;   et al. | 2017-06-22 |
Wafer processing method Grant 9,620,355 - Ryo , et al. April 11, 2 | 2017-04-11 |
Protective film detecting apparatus and protective film detecting method Grant 9,613,415 - Kudo , et al. April 4, 2 | 2017-04-04 |
Wafer Processing Method App 20170032985 - Ryo; Senichi ;   et al. | 2017-02-02 |
Laser Processing Method App 20170033007 - Ohura; Yukinobu ;   et al. | 2017-02-02 |
Wafer Processing Method App 20170025269 - Ryo; Senichi ;   et al. | 2017-01-26 |
Method Of Dividing Wafer App 20160307851 - Ohura; Yukinobu ;   et al. | 2016-10-20 |
Protective Film Detecting Method App 20160266037 - Ryo; Senichi ;   et al. | 2016-09-15 |
Protective Film Detecting Apparatus And Protective Film Detecting Method App 20160125591 - Kudo; Yu ;   et al. | 2016-05-05 |
Wafer Processing Method App 20140206177 - Ogawa; Yuki ;   et al. | 2014-07-24 |
Laser Processing Method And Fine Particle Layer Forming Agent App 20140175070 - Ohura; Yukinobu ;   et al. | 2014-06-26 |
Ablation Method App 20130087947 - KITAHARA; Nobuyasu ;   et al. | 2013-04-11 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.