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Ohto; Michiaki Patent Filings

Ohto; Michiaki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ohto; Michiaki.The latest application filed is for "copper alloy backing tube and method of manufacturing copper alloy backing tube".

Company Profile
2.2.5
  • Ohto; Michiaki - Osaka JP
  • Ohto; Michiaki - Iwaki-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Copper Alloy Backing Tube And Method Of Manufacturing Copper Alloy Backing Tube
App 20190119786 - Kato; Shinji ;   et al.
2019-04-25
Hot Extruded Material For Cylindrical Sputtering Target And Method Of Manufacturing Cylindrical Sputtering Target
App 20190055625 - Ohto; Michiaki ;   et al.
2019-02-21
Manufacturing method of cylindrical sputtering target material
Grant 9,982,335 - Sakurai , et al. May 29, 2
2018-05-29
Cylindrical sputtering target material
Grant 9,748,079 - Ohto , et al. August 29, 2
2017-08-29
METHOD FOR MANUFACTURING Ca-CONTAINING COPPER ALLOY
App 20160312335 - KUMAGAI; Satoshi ;   et al.
2016-10-27
Cylindrical Sputtering Target Material
App 20160203959 - OHTO; Michiaki ;   et al.
2016-07-14
Manufacturing Method Of Cylindrical Sputtering Target Material
App 20160194749 - SAKURAI; Akira ;   et al.
2016-07-07

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