loadpatents
name:-0.054753065109253
name:-0.034129858016968
name:-0.00044083595275879
Ohto; Koichi Patent Filings

Ohto; Koichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ohto; Koichi.The latest application filed is for "semiconductor device and manufacturing method thereof".

Company Profile
0.34.38
  • Ohto; Koichi - Kanagawa JP
  • Ohto; Koichi - Kawasaki N/A JP
  • OHTO; Koichi - Kawasaki-shi JP
  • Ohto; Koichi - Nakahara-ku JP
  • Ohto; Koichi - Tokyo JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor device and manufacturing method thereof
Grant 8,749,058 - Usami , et al. June 10, 2		2014-06-10
Semiconductor device having silicon-diffused metal wiring layer and its manufacturing method
Grant 8,642,467 - Ohto , et al. February 4, 2		2014-02-04
Semiconductor device and method of manufacturing the same
Grant 8,486,836 - Oshida , et al. July 16, 2		2013-07-16
Method of manufacturing semiconductor device
Grant 8,435,828 - Yamamoto , et al. May 7, 2		2013-05-07
Semiconductor Device And Manufacturing Method Thereof
App 20120181694 - Usami; Tatsuya ;   et al.		2012-07-19
Semiconductor Device Having Silicon-diffused Metal Wiring Layer And Its Manufacturing Method
App 20120108060 - OHTO; Koichi ;   et al.		2012-05-03
Semiconductor device having silicon-diffused metal wiring layer and its manufacturing method
Grant 8,115,318 - Ohto , et al. February 14, 2		2012-02-14
Semiconductor Device And Method Of Manufacturing The Same
App 20110318900 - OSHIDA; Daisuke ;   et al.		2011-12-29
Semiconductor device and method of manufacturing the same
Grant 8,030,737 - Oshida , et al. October 4, 2		2011-10-04
Method Of Manufacturing Semiconductor Device
App 20110171775 - YAMAMOTO; Hironori ;   et al.		2011-07-14
Method of manufacturing a semiconductor device
Grant 7,910,474 - Usami , et al. March 22, 2		2011-03-22
Semiconductor device having projection on lower electrode and method for forming the same
Grant 7,897,475 - Oshida , et al. March 1, 2		2011-03-01
Semiconductor device having silicon-diffused metal wiring layer and its manufacturing method
Grant 7,842,602 - Ohto , et al. November 30, 2		2010-11-30
Method for manufacturing a semiconductor device having a multi-layered insulating structure of SiOCH layers and an SiO.sub.2 layer
Grant 7,833,901 - Ohto , et al. November 16, 2		2010-11-16
Semiconductor Device Having Silicon-diffused Metal Wiring Layer And Its Manufacturing Method
App 20100224995 - Ohto; Koichi ;   et al.		2010-09-09
Organic insulating film, manufacturing method thereof, semiconductor device using such organic insulating film and manufacturing method thereof
Grant 7,763,979 - Ohto , et al. July 27, 2		2010-07-27
Semiconductor device and method of manufacturing the same
Grant 7,745,937 - Usami , et al. June 29, 2		2010-06-29
Semiconductor method having silicon-diffused metal wiring layer
Grant 7,737,555 - Ohto , et al. June 15, 2		2010-06-15
Single damascene structure semiconductor device having silicon-diffused metal wiring layer
Grant 7,687,917 - Ohto , et al. March 30, 2		2010-03-30
Semiconductor device
Grant 7,649,258 - Usami , et al. January 19, 2		2010-01-19
Method of manufacturing a semiconductor device
Grant 7,615,498 - Sasaki , et al. November 10, 2		2009-11-10
Manufacturing method of semiconductor device
Grant 7,563,705 - Tonegawa , et al. July 21, 2		2009-07-21
Semiconductor chip
Grant 7,564,132 - Ohto , et al. July 21, 2		2009-07-21
Semiconductor device and method for manufacturing same
Grant 7,557,447 - Usami , et al. July 7, 2		2009-07-07
Semiconductor device
Grant 7,531,891 - Ohto , et al. May 12, 2		2009-05-12
Semiconductor device and method for manufacturing same
Grant 7,473,630 - Usami , et al. January 6, 2		2009-01-06
Semiconductor device having projection on lower electrode and method for forming the same
App 20080237793 - Oshida; Daisuke ;   et al.		2008-10-02
Semiconductor Device And Method Of Manufacturing The Same
App 20080217737 - OSHIDA; Daisuke ;   et al.		2008-09-11
Semiconductor Device And Manufacturing Method Thereof
App 20080194102 - USAMI; Tatsuya ;   et al.		2008-08-14
Semiconductor device and manufacturing method thereof
Grant 7,391,115 - Usami , et al. June 24, 2		2008-06-24
Organic Insulating Film, Manufacturing Method Thereof, Semiconductor Device Using Such Organic Insulating Film And Manufacturing Method Thereof
App 20070246804 - Ohto; Koichi ;   et al.		2007-10-25
Semiconductor Device Having Silicon-diffused Metal Wiring Layer And Its Manufacturing Method
App 20070212809 - Ohto; Koichi ;   et al.		2007-09-13
Manufacturing method of semiconductor device
Grant 7,268,087 - Aoki , et al. September 11, 2		2007-09-11
Semiconductor device and method for manufacturing same
App 20070182014 - Usami; Tatsuya ;   et al.		2007-08-09
Method of manufacturing a semiconductor device
App 20070117405 - Sasaki; Yoichi ;   et al.		2007-05-24
Semiconductor device having silicon-diffused metal wiring layer and its manufacturing method
App 20070108620 - Ohto; Koichi ;   et al.		2007-05-17
Semiconductor device, and production method for manufacturing such semiconductor device
App 20070045861 - Ohto; Koichi ;   et al.		2007-03-01
Semiconductor device and method of manufacturing a semiconductor device
Grant 7,180,191 - Sasaki , et al. February 20, 2		2007-02-20
Semiconductor device and method for manufacturing same
App 20070032070 - Usami; Tatsuya ;   et al.		2007-02-08
Semiconductor device and method for manufacturing same
Grant 7,135,776 - Usami , et al. November 14, 2		2006-11-14
Semiconductor device having two distinct sioch layers
Grant 7,132,732 - Ohto , et al. November 7, 2		2006-11-07
Semiconductor interconnect structure
Grant 7,119,441 - Ohto , et al. October 10, 2		2006-10-10
Semiconductor chip
App 20060208361 - Ohto; Koichi ;   et al.		2006-09-21
Semiconductor device and method of manufacturing the same
App 20060186549 - Usami; Tatsuya ;   et al.		2006-08-24
Method of fabricating semiconductor device using plasma-enhanced CVD
Grant 7,074,698 - Morita , et al. July 11, 2		2006-07-11
Manufacturing method of semiconductor device
App 20060141778 - Tonegawa; Takashi ;   et al.		2006-06-29
Semiconductor device and method for manufacturing same
App 20060060975 - Usami; Tatsuya ;   et al.		2006-03-23
Semiconductor device
App 20060038297 - Usami; Tatsuya ;   et al.		2006-02-23
Semiconductor device
App 20050167844 - Ohto, Koichi ;   et al.		2005-08-04
Semiconductor device and method of manufacturing a semiconductor device
App 20050170633 - Sasaki, Yoichi ;   et al.		2005-08-04
Semiconductor interconnect structure
App 20050159012 - Ohto, Koichi ;   et al.		2005-07-21
Semiconductor device and method and apparatus for manufacturing the same
Grant 6,879,042 - Ohto , et al. April 12, 2		2005-04-12
Manufacturing method of semiconductor device
App 20040266171 - Aoki, Hidemitsu ;   et al.		2004-12-30
Semiconductor device, and production method for manufacturing such semiconductor device
App 20040183162 - Ohto, Koichi ;   et al.		2004-09-23
Method of fabricating semiconductor device using Plasma-Enhanced CVD
App 20040185668 - Morita, Noboru ;   et al.		2004-09-23
Manufacturing method of semicondcutor device
Grant 6,787,480 - Aoki , et al. September 7, 2		2004-09-07
Semiconductor device and manufacturing method thereof
App 20040155342 - Usami, Tatsuya ;   et al.		2004-08-12
Organic insulating film, manufacturing method thereof, semiconductor device using such organic insulating film and manufacturing method thereof
App 20040152334 - Ohto, Koichi ;   et al.		2004-08-05
Semiconductor device having silicon-diffused metal wiring layer and its manufacturing method
App 20040046261 - Ohto, Koichi ;   et al.		2004-03-11
Method for forming a capping layer on a copper interconnect
App 20040029380 - Ohto, Koichi		2004-02-12
Semiconductor device having silicon-including metal wiring layer and its manufacturing method
App 20030209738 - Ohto, Koichi ;   et al.		2003-11-13
Manufacturing method of semiconductor device
App 20030155657 - Tonegawa, Takashi ;   et al.		2003-08-21
Method for forming a capping layer on a copper interconnect
App 20020197865 - Ohto, Koichi		2002-12-26
Manufacturing method of semiconductor device
App 20020155702 - Aoki, Hidemitsu ;   et al.		2002-10-24
Semiconductor device and method and apparatus for manufacturing the same
App 20010054765 - Ohto, Koichi ;   et al.		2001-12-27
Plasma CVD apparatus
App 20010047759 - Matsui, Takayuki ;   et al.		2001-12-06
Method For Forming Metal Nitride Film
App 20010035241 - OHTO, KOICHI		2001-11-01
Method for fabricating semiconductor device and apparatus for fabricating same
App 20010003064 - Ohto, Koichi		2001-06-07

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