Ohtani; Yoshikazu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ohtani; Yoshikazu.The latest application filed is for "workpiece-separating device and workpiece-separating method".

Company Profile

4.4.5

Ohtani; Yoshikazu - Annaka JP
OHTANI; Yoshikazu - Gunma JP
OHTANI; Yoshikazu - Annaka-shi JP
OHTANI; Yoshikazu - Tokyo JP
Ohtani; Yoshikazu - Gunma-ken JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Substrate processing apparatus and substrate processing method Grant 11,322,384 - Kubota , et al. May 3, 2	2022-05-03
Workpiece-separating Device And Workpiece-separating Method App 20220068676 - TOMIOKA; Kyouhei ; et al.	2022-03-03
Workpiece-separating device and workpiece-separating method Grant 11,251,058 - Tomioka , et al. February 15, 2	2022-02-15
Workpiece-separating Device And Workpiece-separating Method App 20210245297 - OHTANI; Yoshikazu ; et al.	2021-08-12
Substrate Processing Apparatus And Substrate Processing Method App 20210098279 - KUBOTA; Shunya ; et al.	2021-04-01
Workpiece-separating device and workpiece-separating method Grant 10,840,141 - Ohtani , et al. November 17, 2	2020-11-17
Workpiece-separating Device And Workpiece-separating Method App 20200312716 - OHTANI; Yoshikazu ; et al.	2020-10-01
Resin-sealing Device And Resin-sealing Method App 20190109021 - OHTANI; Yoshikazu ; et al.	2019-04-11
Electrostatic holding apparatus having insulating layer with enables easy attachment and detachment of semiconductor object Grant 6,351,367 - Mogi , et al. February 26, 2	2002-02-26

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