Ohtani; Tatsuo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ohtani; Tatsuo.The latest application filed is for "water-soluble polyalkylene oxide-modified product".

Company Profile

0.11.6

Ohtani; Tatsuo - Himeji N/A JP
Ohtani; Tatsuo - Himeji-shi JP
Ohtani; Tatsuo - Fukushima-ken JP
Ohtani; Tatsuo - Fukushima JP
Ohtani; Tatsuo - Nishigo-mura Nishi-shirakawa-gun Fukushima-ken JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Resin composition whose lubricity under wet conditions is maintained Grant 10,000,629 - Ozawa , et al. June 19, 2	2018-06-19
Water-soluble polyalkylene oxide-modified product Grant 9,622,961 - Ozawa , et al. April 18, 2	2017-04-18
Sheet whose lubricity is maintained under wet conditions Grant 9,574,154 - Ozawa , et al. February 21, 2	2017-02-21
Water-soluble Polyalkylene Oxide-modified Product App 20130310465 - Ozawa; Hitoshi ; et al.	2013-11-21
Resin Composition Whose Lubricity Under Wet Conditions Is Maintained App 20130040868 - Ozawa; Hitoshi ; et al.	2013-02-14
Sheet Whose Lubricity Is Maintained Under Wet Conditions App 20130012677 - Ozawa; Hitoshi ; et al.	2013-01-10
Resin Composition Whose Lubricity Under Wet Conditions Is Maintained App 20120094880 - Ozawa; Hitoshi ; et al.	2012-04-19
Method and apparatus for wafer chamfer polishing Grant 5,547,415 - Hasegawa , et al. August 20, 1	1996-08-20
Apparatus for polishing the periphery portion of a wafer Grant 5,476,413 - Hasegawa , et al. December 19, 1	1995-12-19
Apparatus for polishing notch portion of wafer Grant 5,458,529 - Hasegawa , et al. October 17, 1	1995-10-17
Wafer chamfer polishing apparatus with rotary circular dividing table Grant 5,404,678 - Hasegawa , et al. April 11, 1	1995-04-11
Method and an apparatus for polishing wafer chamfers Grant 5,316,620 - Hasegawa , et al. May 31, 1	1994-05-31

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