Ohtani; Kohsuke

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ohtani; Kohsuke.The latest application filed is for "validating firmware on a computing device".

Company Profile

1.13.9

Ohtani; Kohsuke - Tokyo JP
Ohtani; Kohsuke - Ichihara N/A JP
Ohtani; Kohsuke - Chiba N/A JP
Ohtani; Kohsuke - Tokyo-to N/A JP
Ohtani; Kohsuke - Ichihara-shi JP
Ohtani; Kohsuke - Sodegaura JP
Ohtani, Kohsuke - Sodegaura-shi JP
Ohtani; Kohsuke - Osaka JP
Ohtani; Kohsuke - Sagamihara JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Validating firmware on a computing device Grant 10,372,914 - Goodman , et al.	2019-08-06
Thermoplastic elastomer composition and composite molded body Grant 9,694,522 - Ohtani , et al. July 4, 2	2017-07-04
Validating Firmware On A Computing Device App 20160378990 - Goodman; Steven D. ; et al.	2016-12-29
Allowing bypassing of boot validation in a computer system having secure boot enabled by default only under certain circumstances Grant 9,292,302 - Sasaki , et al. March 22, 2	2016-03-22
Thermoplastic elastomer composition, a method for producing a molded body, and a molded body Grant 8,669,329 - Ohtani , et al. March 11, 2	2014-03-11
Apparatus and methods for setting security to storage unit and computer Grant 8,566,951 - Horiuchi , et al. October 22, 2	2013-10-22
Method For Booting Computer And Computer App 20130191622 - Sasaki; Ken ; et al.	2013-07-25
Thermoplastic Elastomer Composition And Composite Molded Body App 20100207365 - Ohtani; Kohsuke ; et al.	2010-08-19
Thermoplastic Elastomer Composition, A Method For Producing A Molded Body, And A Molded Body App 20090270561 - OHTANI; Kohsuke ; et al.	2009-10-29
Thermoplastic Elastomer Composition And Composite Molding App 20090192250 - IJICHI; Yasuhito ; et al.	2009-07-30
Apparatus And Methods For Setting Security To Storage Unit And Computer App 20080276059 - Horiuchi; Yasuhiro ; et al.	2008-11-06
Resin composition, laminate and production of laminate Grant 7,087,678 - Ohtani , et al. August 8, 2	2006-08-08
Resin composition, laminate and production of laminate App 20050032986 - Ohtani, Kohsuke ; et al.	2005-02-10
Resin composition, laminate and production of laminate Grant 6,808,810 - Ohtani , et al. October 26, 2	2004-10-26
Polymer composition for powder molding, powder thereof, foamed articles, and method for producing foamed article App 20030087085 - Iketani, Kohichi ; et al.	2003-05-08
Thermoplastic olefin elastomer composition for powder molding, powder for powder molding, and molded object Grant 6,531,545 - Nakatsuji , et al. March 11, 2	2003-03-11
Resin composition, laminate and production of laminate App 20020132124 - Ohtani, Kohsuke ; et al.	2002-09-19
Method for producing a multi-layer molded article Grant 6,045,732 - Nakatsuji , et al. April 4, 2	2000-04-04
Power management apparatus and method for an information processing system Grant 5,822,597 - Kawano , et al. October 13, 1	1998-10-13

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