Patent | Date |
---|
Method of plasma etching of silicon-containing organic film using sulfur-based chemistry Grant 10,529,589 - Karakas , et al. J | 2020-01-07 |
Power modulation for etching high aspect ratio features Grant 10,410,873 - Ohtake , et al. Sept | 2019-09-10 |
Process for performing self-limited etching of organic materials Grant 10,381,238 - Ohtake , et al. A | 2019-08-13 |
Multi-frequency power modulation for etching high aspect ratio features Grant 10,340,123 - Ohtake | 2019-07-02 |
Method Of Plasma Etching Of Silicon-containing Organic Film Using Sulfur-based Chemistry App 20180358233 - Karakas; Erdinc ;   et al. | 2018-12-13 |
Selective SiARC removal Grant 10,115,591 - Sridhar , et al. October 30, 2 | 2018-10-30 |
Process For Performing Self-limited Etching Of Organic Materials App 20180254191 - Ohtake; Hiroto ;   et al. | 2018-09-06 |
Selective SiARC Removal App 20180197730 - Sridhar; Shyam ;   et al. | 2018-07-12 |
Multi-frequency Power Modulation For Etching High Aspect Ratio Features App 20170345619 - Ohtake; Hiroto | 2017-11-30 |
Power Modulation For Etching High Aspect Ratio Features App 20170207099 - Ohtake; Hiroto ;   et al. | 2017-07-20 |
Plasma etching method Grant 9,570,312 - Takeda , et al. February 14, 2 | 2017-02-14 |
Method of selectively removing a region formed of silicon oxide and plasma processing apparatus Grant 9,502,537 - Kitamura , et al. November 22, 2 | 2016-11-22 |
Plasma etching method Grant 9,412,607 - Kamada , et al. August 9, 2 | 2016-08-09 |
Multilayer film etching method and plasma processing apparatus Grant 9,373,520 - Yoshimura , et al. June 21, 2 | 2016-06-21 |
Plasma processing method Grant 9,305,795 - Kamada , et al. April 5, 2 | 2016-04-05 |
Etching method Grant 9,105,585 - Matsuoka , et al. August 11, 2 | 2015-08-11 |
Etching method Grant 9,087,798 - Ohtake , et al. July 21, 2 | 2015-07-21 |
Multilayer Film Etching Method And Plasma Processing Apparatus App 20150140822 - YOSHIMURA; Shota ;   et al. | 2015-05-21 |
Semiconductor device manufacturing method Grant 9,034,698 - Ozu , et al. May 19, 2 | 2015-05-19 |
Plasma Etching Method App 20150099366 - Takeda; Ryohei ;   et al. | 2015-04-09 |
Plasma Processing Method App 20150064926 - Kamada; Tomiko ;   et al. | 2015-03-05 |
Method Of Selectively Removing A Region Formed Of Silicon Oxide And Plasma Processing Apparatus App 20150064922 - KITAMURA; Akinori ;   et al. | 2015-03-05 |
Semiconductor Device Manufacturing Method App 20150056773 - Ozu; Toshihisa ;   et al. | 2015-02-26 |
Etching Method App 20150044877 - Ohtake; Hiroto ;   et al. | 2015-02-12 |
Plasma Etching Method App 20140332372 - Kamada; Tomiko ;   et al. | 2014-11-13 |
Etching Method App 20140308817 - Matsuoka; Hironori ;   et al. | 2014-10-16 |
Dry metal etching method Grant 8,808,562 - Ohsawa , et al. August 19, 2 | 2014-08-19 |
Semiconductor device capable of reducing interelectrode leak current and manufacturing method thereof Grant 8,803,285 - Ohtake , et al. August 12, 2 | 2014-08-12 |
Highly selective spacer etch process with reduced sidewall spacer slimming Grant 8,664,125 - Raley , et al. March 4, 2 | 2014-03-04 |
Wiring structure and method for manufacturing the same Grant 8,592,303 - Tada , et al. November 26, 2 | 2013-11-26 |
Highly Selective Spacer Etch Process With Reduced Sidewall Spacer Slimming App 20130164940 - RALEY; Angelique Denise ;   et al. | 2013-06-27 |
Dry Metal Etching Method App 20130065398 - OHSAWA; Yusuke ;   et al. | 2013-03-14 |
Semiconductor device Grant 8,278,763 - Tada , et al. October 2, 2 | 2012-10-02 |
Semiconductor Device App 20120013023 - TADA; Munehiro ;   et al. | 2012-01-19 |
Method Of Producing A Dual Damascene Multilayer Interconnection And Multilayer Interconnection Structure App 20110316161 - OHTAKE; Hiroto ;   et al. | 2011-12-29 |
Semiconductor device, method for manufacturing semiconductor device and apparatus for manufacturing semiconductor Grant 8,043,957 - Tada , et al. October 25, 2 | 2011-10-25 |
Multilayer wiring structure, semiconductor device, pattern transfer mask and method for manufacturing multilayer wiring structure Grant 7,999,392 - Ohtake , et al. August 16, 2 | 2011-08-16 |
Wiring Structure And Method For Manufacturing The Same App 20100151675 - TADA; Munehiro ;   et al. | 2010-06-17 |
Wiring structure and method for manufacturing the same Grant 7,701,060 - Tada , et al. April 20, 2 | 2010-04-20 |
Semiconductor device and having trench interconnection Grant 7,622,808 - Ohtake , et al. November 24, 2 | 2009-11-24 |
Semiconductor Device, Method For Manufacturing Semiconductor Device And Apparatus For Manufacturing Semiconductor App 20090267198 - Tada; Munehiro ;   et al. | 2009-10-29 |
Semiconductor device and its manufacturing method Grant 7,482,694 - Ohtake , et al. January 27, 2 | 2009-01-27 |
Method Of Producing Multilayer Interconnection And Multilayer Interconnection Structure App 20090014887 - Ohtake; Hiroto ;   et al. | 2009-01-15 |
Multilayer Wiring Structure, Semiconductor Device, Pattern Transfer Mask and Method for Manufacturing Multilayer Wiring Structure App 20080136043 - Ohtake; Hiroto ;   et al. | 2008-06-12 |
Semiconductor Device Capable Of Reducing Interelectrode Leak Current And Manufacturing Method Thereof App 20070262417 - Ohtake; Hiroto ;   et al. | 2007-11-15 |
Wiring structure and method for manufacturing the same App 20070013069 - Tada; Munehiro ;   et al. | 2007-01-18 |
Semiconductor device having trench interconnection and manufacturing method of semiconductor device App 20060131754 - Ohtake; Hiroto ;   et al. | 2006-06-22 |
Method of manufacturing a semiconductor device capable of etching a multi-layer of organic films at a high selectivity Grant 6,972,453 - Ohtake , et al. December 6, 2 | 2005-12-06 |
Semiconductor device and its manufacturing method App 20050253272 - Ohtake, Hiroto ;   et al. | 2005-11-17 |
Method of manufacturing a semiconductor device capable of etching a multi-layer of organic films at a high selectivity App 20020155639 - Ohtake, Hiroto ;   et al. | 2002-10-24 |
Method for plasma treatment and apparatus for plasma treatment Grant 6,054,063 - Ohtake , et al. April 25, 2 | 2000-04-25 |