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Patent applications and USPTO patent grants for Ohshita; Yoshio.The latest application filed is for "film forming method".
Patent | Date |
---|---|
Film forming method Grant 7,312,140 - Machida , et al. December 25, 2 | 2007-12-25 |
Film forming material, film forming method, and silicide film Grant 7,045,457 - Machida , et al. May 16, 2 | 2006-05-16 |
Film forming method App 20060068101 - Machida; Hideaki ;   et al. | 2006-03-30 |
Film forming method App 20060067230 - Machida; Hideaki ;   et al. | 2006-03-30 |
Film forming method App 20060068103 - Machida; Hideaki ;   et al. | 2006-03-30 |
Film forming method App 20060068100 - Machida; Hideaki ;   et al. | 2006-03-30 |
Film forming method App 20060030161 - Machida; Hideaki ;   et al. | 2006-02-09 |
Film forming material, film forming method, and silicide film App 20050059243 - Machida, Hideaki ;   et al. | 2005-03-17 |
Film forming material, film forming method, and film App 20050048799 - Machida, Hideaki ;   et al. | 2005-03-03 |
Method of forming fine copper conductor pattern Grant 5,515,985 - Ohshita , et al. May 14, 1 | 1996-05-14 |
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