OHSHIN MLP CO., LTD.
Patent Applications and Registrations
Patent applications and USPTO patent grants for OHSHIN MLP CO., LTD..The latest application filed is for "multi-layered sheet, thermal structure comprising it, and process for producing multi-layered sheet".
- OHSHIN MLP CO., LTD. - Fukui JP
- OHSHIN MLP CO., LTD. - Echizen-shi JP
- Ohshin MLP Co., Ltd. - Takefu-shi JP
- Ohshin MLP Co., Ltd. -
| Patent | Date |
|---|---|
| Multi-layered Sheet, Thermal Structure Comprising It, And Process For Producing Multi-layered Sheet App 20130276772 - Ota; Keizo | 2013-10-24 |
| Structure For Cooling App 20100108287 - Ota; Keizo ; et al. | 2010-05-06 |
| Exothermic Structure That Is Directly Applied To Skin And Method For Preparing The Structure App 20100087902 - Ota; Keizo ; et al. | 2010-04-08 |
| Self-heating and adhesive device Grant 7,621,110 - Ota , et al. November 24, 2 | 2009-11-24 |
| Kit Comprising Exothermic Structure And At Least Two Pressure Sensitive Adhesive Structures App 20090188614 - Ota; Keizo ; et al. | 2009-07-30 |
| Cooling Or Heating Sheet App 20090088825 - Ota; Keizo | 2009-04-02 |
| Exothermic structure that is directly applied to skin App 20060282138 - Ota; Keizo | 2006-12-14 |
| Sheet-like face pack and kits for face packs App 20060217790 - Ota; Keizo ; et al. | 2006-09-28 |
| Self-heating and adhesive device App 20060210752 - Ota; Keizo ; et al. | 2006-09-21 |
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