Ohsawa; Fumio
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ohsawa; Fumio.The latest application filed is for "substrate connection structure using substrate connector".
- Ohsawa; Fumio - Tokyo JP
| Patent | Date |
|---|---|
| Substrate connection structure using substrate connector Grant 9,196,984 - Ishida , et al. November 24, 2 | 2015-11-24 |
| Substrate Connection Structure Using Substrate Connector App 20140315419 - ISHIDA; Yoshiyasu ; et al. | 2014-10-23 |
| Module connector Grant 7,153,144 - Ohsawa , et al. December 26, 2 | 2006-12-26 |
| Module connector App 20050176288 - Ohsawa, Fumio ; et al. | 2005-08-11 |
| Connector for connecting with flexible substrates Grant 6,893,278 - Ohsawa May 17, 2 | 2005-05-17 |
| Connector for connecting with flexible substrates App 20030134533 - Ohsawa, Fumio | 2003-07-17 |
| Flat cable connector for attaching a flat cable to a circuit board Grant 6,379,176 - Ohsawa , et al. April 30, 2 | 2002-04-30 |
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