Ohnuma; Ikuo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ohnuma; Ikuo.The latest application filed is for "cobalt-base alloy with high heat resistance and high strength and process for producing the same".

Company Profile

0.10.11

Ohnuma; Ikuo - Shibata-gun JP
Ohnuma; Ikuo - Miyagi JP
Ohnuma; Ikuo - Sendai-shi JP
Ohnuma; Ikuo - Sendai N/A JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Hydrogen gas generating member and hydrogen gas producing method therefor Grant 9,617,622 - Ishida , et al. April 11, 2	2017-04-11
Cobalt-base alloy with high heat resistance and high strength and process for producing the same Grant 9,453,274 - Ishida , et al. September 27, 2	2016-09-27
Fe-based shape memory alloy and its production method Grant 8,815,027 - Ishida , et al. August 26, 2	2014-08-26
Cobalt-base Alloy With High Heat Resistance And High Strength And Process For Producing The Same App 20140007995 - Ishida; Kiyohito ; et al.	2014-01-09
Copper Alloy And Process For Producing Copper Alloy App 20130333812 - Ishida; Kiyohito ; et al.	2013-12-19
Cobalt-base alloy with high heat resistance and high strength and process for producing the same Grant 8,551,265 - Ishida , et al. October 8, 2	2013-10-08
Solder material, method for manufacturing the same, joined body, method for manufacturing the same, power semiconductor module, and method for manufacturing the same Grant 8,283,783 - Yamada , et al. October 9, 2	2012-10-09
Fe-based Shape Memory Alloy And Its Production Method App 20120199253 - Ishida; Kiyohito ; et al.	2012-08-09
Hydrogen Gas Generating Member And Hydrogen Gas Producing Method Therefor App 20120107228 - Ishida; Kiyohito ; et al.	2012-05-03
Solder Material, Method For Manufacturing The Same, Joined Body, Method For Manufacturing The Same, Power Semiconductor Module, And Method For Manufacturing The Same App 20100193801 - Yamada; Yasushi ; et al.	2010-08-05
Power Semiconductor Module App 20100109016 - Yagi; Yuji ; et al.	2010-05-06
Iridium-based alloy with high heat resistance and high strength and process for producing the same Grant 7,666,352 - Ishida , et al. February 23, 2	2010-02-23
Iridium-based Alloy With High Heat Resistance And High Strength And Process For Producing The Same App 20080206090 - ISHIDA; Kiyohito ; et al.	2008-08-28
Cobalt-base Alloy With High Heat Resistance And High Strength And Process For Producing The Same App 20080185078 - ISHIDA; Kiyohito ; et al.	2008-08-07
Member having separation structure and method for manufacture thereof Grant 7,261,760 - Ishida , et al. August 28, 2	2007-08-28
Thermoelectric module and solder therefor App 20060210790 - Horio; Yuma ; et al.	2006-09-21
Member having separation structure and method for manufacture thereof App 20040108597 - Ishida, Kiyohito ; et al.	2004-06-10

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