Ohnishi; Tsukasa
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ohnishi; Tsukasa.The latest application filed is for "lead-free solder alloy".
- Ohnishi; Tsukasa - Tokyo JP
- Ohnishi; Tsukasa - Koshigaya N/A JP
- Ohnishi; Tsukasa - Sapporo JP
- Ohnishi; Tsukasa - Sapporo-shi JP
- Ohnishi; Tsukasa - Adachi-ku JP
- Ohnishi; Tsukasa - Saitama JP
- Ohnishi; Tsukasa - Souka JP
- Ohnishi; Tsukasa - Souka-shi JP
- Ohnishi; Tsukasa - Souka-shi Saitama JP
| Patent | Date |
|---|---|
| Lead-Free Solder Alloy App 20190076966 - Ohnishi; Tsukasa ; et al. | 2019-03-14 |
| Sn-Cu-based lead-free solder alloy Grant 10,137,536 - Ohnishi , et al. November 27, 2 | 2018-11-27 |
| Lead-free solder alloy Grant 10,076,808 - Ohnishi , et al. September 18, 2 | 2018-09-18 |
| Lead-free solder alloy Grant 9,844,837 - Shimamura , et al. December 19, 2 | 2017-12-19 |
| Lead-free solder alloy, connecting member and a method for its manufacture, and electronic part Grant 9,773,721 - Yoshikawa , et al. September 26, 2 | 2017-09-26 |
| Lead-free solder ball Grant 9,527,167 - Ohnishi , et al. December 27, 2 | 2016-12-27 |
| Lead-Free Solder Ball App 20160339543 - Ohnishi; Tsukasa ; et al. | 2016-11-24 |
| Lead-free solder connection structure and solder ball Grant 8,975,757 - Ueshima , et al. March 10, 2 | 2015-03-10 |
| Lead-Free Solder Alloy App 20150037088 - Ohnishi; Tsukasa ; et al. | 2015-02-05 |
| Sn-cu-based Lead-free Solder Alloy App 20150029670 - Ohnishi; Tsukasa ; et al. | 2015-01-29 |
| Solder alloy Grant 8,932,519 - Ishibashi , et al. January 13, 2 | 2015-01-13 |
| Bonding material for semiconductor devices Grant 8,896,119 - Sakamoto , et al. November 25, 2 | 2014-11-25 |
| Lead-free Solder Alloy, Connecting Member And A Method For Its Manufacture, And Electronic Part App 20140326490 - Yoshikawa; Shunsaku ; et al. | 2014-11-06 |
| Lead-Free Solder Alloy App 20140141273 - Shimamura; Masato ; et al. | 2014-05-22 |
| Lead-free solder alloy Grant 8,691,143 - Ohnishi , et al. April 8, 2 | 2014-04-08 |
| Lead-Free Solder Ball App 20140061287 - Ohnishi; Tsukasa ; et al. | 2014-03-06 |
| Solder Alloy App 20130343809 - Ishibashi; Seiko ; et al. | 2013-12-26 |
| Bonding Material for Semiconductor Devices App 20130134591 - Sakamoto; Yoshitsugu ; et al. | 2013-05-30 |
| Lead-free Solder Alloy, Connecting Member And A Method For Its Manufacture, And Electronic Part App 20120199393 - Yoshikawa; Shunsaku ; et al. | 2012-08-09 |
| Lead-free solder Grant 8,220,692 - Ohnishi , et al. July 17, 2 | 2012-07-17 |
| Lead-free solder alloy Grant 8,216,395 - Munekata , et al. July 10, 2 | 2012-07-10 |
| Lead-free Solder Connection Structure And Solder Ball App 20110115084 - Ueshima; Minoru ; et al. | 2011-05-19 |
| Lead-free Solder App 20110089224 - Ohnishi; Tsukasa ; et al. | 2011-04-21 |
| Lead-free solder alloy App 20100297470 - Munekata; Osamu ; et al. | 2010-11-25 |
| Lead-free solder alloy Grant 7,682,468 - Munekata , et al. March 23, 2 | 2010-03-23 |
| Method of Soldering a Module Board App 20090301760 - Shimamura; Masato ; et al. | 2009-12-10 |
| Lead-free solder alloy App 20090232696 - Ohnishi; Tsukasa ; et al. | 2009-09-17 |
| Lead-free solder alloy App 20080061117 - Munekata; Osamu ; et al. | 2008-03-13 |
| Lead-free solder alloy Grant 7,338,567 - Munekata , et al. March 4, 2 | 2008-03-04 |
| Lead-Free Solder App 20070243098 - Ohnishi; Tsukasa ; et al. | 2007-10-18 |
| Lead-free solder and soldered article Grant 7,282,174 - Hirata , et al. October 16, 2 | 2007-10-16 |
| Lead-free solder Grant 7,282,175 - Amagai , et al. October 16, 2 | 2007-10-16 |
| Lead-free solder Grant 7,172,726 - Ohnishi February 6, 2 | 2007-02-06 |
| Lead-free solder and soldered article App 20060102690 - Hirata; Masahiko ; et al. | 2006-05-18 |
| Lead-free solder alloy Grant 7,029,542 - Amagai , et al. April 18, 2 | 2006-04-18 |
| Lead-free solder alloy App 20050036902 - Amagai, Masazumi ; et al. | 2005-02-17 |
| Lead-free solder App 20040262779 - Amagai, Masazumi ; et al. | 2004-12-30 |
| Lead-free solder App 20040115088 - Ohnishi, Tsukasa | 2004-06-17 |
| Lead-free solder alloy App 20040062679 - Munekata, Osamu ; et al. | 2004-04-01 |
| Lead-free solder alloy App 20030021718 - Munekata, Osamu ; et al. | 2003-01-30 |
| Method for the treatment of eosinophil-associated diseases by administration of topical anesthetics Grant 5,631,267 - Gleich , et al. May 20, 1 | 1997-05-20 |
| Method for the treatment of bronchial asthma by administration of topical anesthetics Grant 5,510,339 - Gleich , et al. April 23, 1 | 1996-04-23 |
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