Ohmiya; Katsumi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ohmiya; Katsumi.The latest application filed is for "flanged parts producing method, and heat-treating device and heat treating method therefor".
- Ohmiya; Katsumi - Hiratsuka JP
- Ohmiya, Katsumi - Hiratsuka-shi JP
| Patent | Date |
|---|---|
| Flanged parts producing method, and heat-treating device and heat treating method therefor Grant 7,147,731 - Tanaka , et al. December 12, 2 | 2006-12-12 |
| Flanged parts producing method, and heat-treating device and heat treating method therefor App 20040169321 - Tanaka, Yoshimasa ; et al. | 2004-09-02 |
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