Ohmi; Masaru
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ohmi; Masaru.The latest application filed is for "heat sink including a heat dissipating fin and method for fixing the heat dissipating fin".
- Ohmi; Masaru - Tokyo JP
- Ohmi; Masaru - Toyko JP
| Patent | Date |
|---|---|
| Heat sink including a heat dissipating fin and method for fixing the heat dissipating fin Grant 6,742,573 - Sasaki , et al. June 1, 2 | 2004-06-01 |
| Heat pipe hinge structure for electronic device Grant 6,507,490 - Sasaki , et al. January 14, 2 | 2003-01-14 |
| Heat sink including a heat dissipating fin and method for fixing the heat dissipating fin App 20020084060 - Sasaki, Chiyoshi ; et al. | 2002-07-04 |
| Heat pipe hinge structure for electronic device App 20020064027 - Sasaki, Chiyoshi ; et al. | 2002-05-30 |
| Heat pipe hinge structure for electronic device Grant 6,377,452 - Sasaki , et al. April 23, 2 | 2002-04-23 |
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