loadpatents
name:-0.0088460445404053
name:-0.012314796447754
name:-0.00043010711669922
Ohkura; Yoshihiro Patent Filings

Ohkura; Yoshihiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ohkura; Yoshihiro.The latest application filed is for "apparatus for testing a semiconductor device".

Company Profile
0.9.8
  • Ohkura; Yoshihiro - Iwata JP
  • Ohkura; Yoshihiro - Iwata-gun JP
  • Ohkura; Yoshihiro - Shizuoka-Ken JP
  • Ohkura; Yoshihiro - Tokyo JP
  • OHKURA; YOSHIHIRO - Iwata-shi JP
  • Ohkura; Yoshihiro - Aichi-ken JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method and apparatus for inspection of wafer and semiconductor device
Grant 8,224,062 - Ohkura , et al. July 17, 2
2012-07-17
Semiconductor element and wafer level chip size package therefor
Grant 7,830,011 - Nomoto , et al. November 9, 2
2010-11-09
Test chip socket and method for testing a chip
Grant 7,642,799 - Ohkura January 5, 2
2010-01-05
Apparatus for testing a semiconductor device
Grant 7,626,410 - Ohkura December 1, 2
2009-12-01
Electron microscope
Grant 7,388,198 - Ohkura June 17, 2
2008-06-17
Apparatus For Testing A Semiconductor Device
App 20080094094 - OHKURA; YOSHIHIRO
2008-04-24
Test Chip Socket
App 20080054925 - Ohkura; YOSHIHIRO
2008-03-06
Method And Apparatus For Inspection Of Wafer And Semiconductor Device
App 20080037859 - OHKURA; YOSHIHIRO ;   et al.
2008-02-14
Surface mount chip package
Grant 7,262,512 - Ohkura August 28, 2
2007-08-28
Semiconductor device and wire bonding chip size package therefor
Grant 7,230,326 - Ohkura June 12, 2
2007-06-12
Semiconductor device and wire bonding chip size package therefor
App 20060049507 - Ohkura; Yoshihiro
2006-03-09
Electron microscope
App 20060022137 - Ohkura; Yoshihiro
2006-02-02
Semiconductor element and wafer level chip size package therefor
App 20050199995 - Nomoto, Kentaro ;   et al.
2005-09-15
Electron microscope and method of photographing TEM images
Grant 6,800,853 - Ohkura October 5, 2
2004-10-05
Surface mount chip package
App 20040124514 - Ohkura, Yoshihiro
2004-07-01
Input device for use in vehicles for inputting settings pertaining to driver's intention of acceleration and deceleration
Grant 6,621,176 - Nagasaka , et al. September 16, 2
2003-09-16
Electron microscope and method of photographing TEM images
App 20020100873 - Ohkura, Yoshihiro
2002-08-01

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