loadpatents
Patent applications and USPTO patent grants for Ohkubo; Yasunori.The latest application filed is for "semiconductor substrate, semiconductor device, and processes of production of same".
Patent | Date |
---|---|
Semiconductor substrate, semiconductor device, and processes of production of same Grant 6,846,723 - Ohkubo January 25, 2 | 2005-01-25 |
Semiconductor substrate, semiconductor device, and processes of production of same App 20040007739 - Ohkubo, Yasunori | 2004-01-15 |
Semiconductor substrate, semiconductor device, and processes of production of same Grant 6,580,128 - Ohkubo June 17, 2 | 2003-06-17 |
Substrate having a semiconductor layer, and method for fabricating the same Grant 6,503,811 - Ohkubo January 7, 2 | 2003-01-07 |
Semiconductor substrate, semiconductor device, and processes of production of same App 20010007367 - Ohkubo, Yasunori | 2001-07-12 |
Method and apparatus for wafer bonding Grant 5,769,991 - Miyazawa , et al. June 23, 1 | 1998-06-23 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.