Ohkawado; Etsuo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ohkawado; Etsuo.The latest application filed is for "photosensitive resin composition, dry film, and processed product made using the same".

Company Profile

0.9.6

Ohkawado; Etsuo - Chiba N/A JP
Ohkawado; Etsuo - Sodegaura JP
Ohkawado, Etsuo - Sodegaura-shi JP
Ohkawado; Etsuo - Kanagawa JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Photosensitive resin composition, dry film, and processed product made using the same Grant 8,409,784 - Funaki , et al. April 2, 2	2013-04-02
Photosensitive resin composition, dry film, and processed product made using the same Grant 8,361,605 - Funaki , et al. January 29, 2	2013-01-29
Resin composition, dry film, and processed product made using the same Grant 8,362,103 - Funaki , et al. January 29, 2	2013-01-29
Composition for forming wiring protective film and uses thereof Grant 7,851,124 - Funaki , et al. December 14, 2	2010-12-14
Photosensitive Resin Composition, Dry Film, And Processed Product Made Using The Same App 20100116532 - Funaki; Katsuhiko ; et al.	2010-05-13
Photosensitive Resin Composition, Dry Film, And Processed Product Made Using The Same App 20100084172 - Funaki; Katsuhiko ; et al.	2010-04-08
Resin Composition, Dry Film, And Processed Product Made Using The Same App 20100059263 - Funaki; Katsuhiko ; et al.	2010-03-11
Photosensitive resin composition, dry film, and workpiece using the same Grant 7,030,170 - Tahara , et al. April 18, 2	2006-04-18
Composition for forming wiring protective film and uses thereof App 20050170270 - Funaki, Katsuhiko ; et al.	2005-08-04
Composition for forming wiring protective film and uses thereof App 20040247908 - Funaki, Katsuhiko ; et al.	2004-12-09
Photosensitive resin composition, dry film, and workpiece using the same App 20030176528 - Tahara, Syuji ; et al.	2003-09-18
Insulating adhesive tape, and lead frame and semiconductor device employing the tape Grant 5,406,124 - Morita , et al. April 11, 1	1995-04-11

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