loadpatents
Patent applications and USPTO patent grants for OHKAWA; Tetsuo.The latest application filed is for "herbicidal composition".
Patent | Date |
---|---|
Herbicidal Composition App 20150021800 - IKEUCHI; Toshihiro ;   et al. | 2015-01-22 |
Herbicidal composition Grant 8,883,687 - Ikeuchi , et al. November 11, 2 | 2014-11-11 |
Phytotoxicity controlling agent for upland farming and phytotoxicity controlling method using the same Grant 8,318,635 - Ikeuchi , et al. November 27, 2 | 2012-11-27 |
Herbicidal Composition App 20120100992 - IKEUCHI; Toshihiro ;   et al. | 2012-04-26 |
Herbicidal composition Grant 8,114,815 - Ikeuchi , et al. February 14, 2 | 2012-02-14 |
Agricultural chemical composition Grant 8,067,337 - Ikeuchi , et al. November 29, 2 | 2011-11-29 |
Granular pesticide preparation Grant 7,829,499 - Yamashita , et al. November 9, 2 | 2010-11-09 |
Granular agrochemical composition Grant 7,638,506 - Ozaki , et al. December 29, 2 | 2009-12-29 |
Phytotoxicity Controlling Agent for Upland Farming and Phytotoxicity Controlling Method Using the Same App 20090111693 - Ikeuchi; Toshihiro ;   et al. | 2009-04-30 |
Agricultural chemical composition App 20090105078 - Ikeuchi; Toshihiro ;   et al. | 2009-04-23 |
Herbicidal Composition App 20090082206 - Ikeuchi; Toshihiro ;   et al. | 2009-03-26 |
Granular agrochemical composition App 20070105720 - Ozaki; Eisuke ;   et al. | 2007-05-10 |
Granular pesticide preparation App 20060287199 - Yamashita; Hayase ;   et al. | 2006-12-21 |
Granular agricultura-chemical composition App 20050250648 - Ozaki, Eisuke ;   et al. | 2005-11-10 |
Polishing system Grant 6,648,728 - Kojima , et al. November 18, 2 | 2003-11-18 |
Polishing method App 20020076838 - Kojima, Hiroyuki ;   et al. | 2002-06-20 |
Polishing system App 20020052166 - Kojima, Hiroyuki ;   et al. | 2002-05-02 |
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