loadpatents
name:-0.012274980545044
name:-0.0088181495666504
name:-0.00040698051452637
OHKAWA; Tetsuo Patent Filings

OHKAWA; Tetsuo

Patent Applications and Registrations

Patent applications and USPTO patent grants for OHKAWA; Tetsuo.The latest application filed is for "herbicidal composition".

Company Profile
0.8.10
  • OHKAWA; Tetsuo - Tokyo JP
  • Ohkawa; Tetsuo - Yokohama JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Herbicidal Composition
App 20150021800 - IKEUCHI; Toshihiro ;   et al.
2015-01-22
Herbicidal composition
Grant 8,883,687 - Ikeuchi , et al. November 11, 2
2014-11-11
Phytotoxicity controlling agent for upland farming and phytotoxicity controlling method using the same
Grant 8,318,635 - Ikeuchi , et al. November 27, 2
2012-11-27
Herbicidal Composition
App 20120100992 - IKEUCHI; Toshihiro ;   et al.
2012-04-26
Herbicidal composition
Grant 8,114,815 - Ikeuchi , et al. February 14, 2
2012-02-14
Agricultural chemical composition
Grant 8,067,337 - Ikeuchi , et al. November 29, 2
2011-11-29
Granular pesticide preparation
Grant 7,829,499 - Yamashita , et al. November 9, 2
2010-11-09
Granular agrochemical composition
Grant 7,638,506 - Ozaki , et al. December 29, 2
2009-12-29
Phytotoxicity Controlling Agent for Upland Farming and Phytotoxicity Controlling Method Using the Same
App 20090111693 - Ikeuchi; Toshihiro ;   et al.
2009-04-30
Agricultural chemical composition
App 20090105078 - Ikeuchi; Toshihiro ;   et al.
2009-04-23
Herbicidal Composition
App 20090082206 - Ikeuchi; Toshihiro ;   et al.
2009-03-26
Granular agrochemical composition
App 20070105720 - Ozaki; Eisuke ;   et al.
2007-05-10
Granular pesticide preparation
App 20060287199 - Yamashita; Hayase ;   et al.
2006-12-21
Granular agricultura-chemical composition
App 20050250648 - Ozaki, Eisuke ;   et al.
2005-11-10
Polishing system
Grant 6,648,728 - Kojima , et al. November 18, 2
2003-11-18
Polishing method
App 20020076838 - Kojima, Hiroyuki ;   et al.
2002-06-20
Polishing system
App 20020052166 - Kojima, Hiroyuki ;   et al.
2002-05-02

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