Ohkawa; Shinya
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ohkawa; Shinya.The latest application filed is for "lead frame".
- Ohkawa; Shinya - Kagoshima-Ken JP
- Ohkawa; Shinya - Sendai JP
| Patent | Date |
|---|---|
| Semiconductor device and wire bonding method therefor Grant 7,777,353 - Ohkawa August 17, 2 | 2010-08-17 |
| Lead frame Grant 7,701,043 - Ohkawa April 20, 2 | 2010-04-20 |
| OFDM transceiver apparatus Grant 7,551,678 - Kiyanagii , et al. June 23, 2 | 2009-06-23 |
| Lead Frame App 20080135996 - OHKAWA; SHINYA | 2008-06-12 |
| Semiconductor Device And Wire Bonding Method Therefor App 20080088012 - OHKAWA; SHINYA | 2008-04-17 |
| OFDM transceiver apparatus App 20050190848 - Kiyanagii, Hiroyuki ; et al. | 2005-09-01 |
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