Ohkawa; Makoto

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ohkawa; Makoto.The latest application filed is for "semiconductor device and cutting equipment for cutting semiconductor device".

Company Profile

0.10.5

Ohkawa; Makoto - Kariya-city JP
Ohkawa; Makoto - Kariya JP
Ohkawa; Makoto - Kariva JP
Ohkawa; Makoto - Toyoake JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and cutting equipment for cutting semiconductor device App 20070235842 - Ohkawa; Makoto	2007-10-11
Semiconductor device, cutting equipment for cutting semiconductor device, and method for cutting the same Grant 7,199,026 - Ohkawa April 3, 2	2007-04-03
Semiconductor device, cutting equipment for cutting semiconductor device, and method for cutting the same App 20050082644 - Ohkawa, Makoto	2005-04-21
Method of etching metallic thin film on thin film resistor Grant 6,809,034 - Ito , et al. October 26, 2	2004-10-26
Method of etching metallic thin film on thin film resistor Grant 6,770,564 - Ito , et al. August 3, 2	2004-08-03
Method for manufacturing semiconductor device by polishing Grant 6,656,755 - Ohkawa December 2, 2	2003-12-02
Method of processing metal and method of manufacturing semiconductor device using the metal Grant 6,645,875 - Ohkawa , et al. November 11, 2	2003-11-11
Method of measuring thickness of a semiconductor layer and method of manufacturing a semiconductor substrate Grant 6,645,045 - Ohkawa November 11, 2	2003-11-11
Method of measuring thickness of a semiconductor layer and method of manufacturing a semiconductor substrate App 20020173084 - Ohkawa, Makoto	2002-11-21
Method of etching metallic thin film on thin film resistor App 20020115299 - Ito, Ichiro ; et al.	2002-08-22
Method of processing metal and method of manufacturing semiconductor device using the metal App 20010029080 - Ohkawa, Makoto ; et al.	2001-10-11
Etching method and method for manufacturing semiconductor device using the same Grant 6,279,585 - Shiraki , et al. August 28, 2	2001-08-28
Semiconductor device equipped with a heat-fusible thin film resistor and production method thereof Grant 5,625,218 - Yamadera , et al. April 29, 1	1997-04-29
Semiconductor device with thin film resistor having reduced film thickness sensitivity during trimming process Grant 5,525,831 - Ohkawa , et al. June 11, 1	1996-06-11
Low temperature sintering ceramic material composition and process for producing the low temperature sintering ceramic Grant 4,829,029 - Kawahara , et al. May 9, 1	1989-05-09

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