OHKAWA; Hiroshige

Patent Applications and Registrations

Patent applications and USPTO patent grants for OHKAWA; Hiroshige.The latest application filed is for "electronic component embedded substrate and circuit module using the same".

Company Profile

0.3.8

OHKAWA; Hiroshige - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic Component Embedded Substrate And Circuit Module Using The Same App 20220238474 - ABE; Toshiyuki ; et al.	2022-07-28
Circuit board incorporating semiconductor IC and manufacturing method thereof Grant 9,635,756 - Tsuyutani , et al. April 25, 2	2017-04-25
Circuit Board Incorporating Semiconductor Ic And Manufacturing Method Thereof App 20140085854 - TSUYUTANI; Kazutoshi ; et al.	2014-03-27
Method of manufacturing wiring board Grant 8,303,752 - Kawabata , et al. November 6, 2	2012-11-06
Method of manufacturing wiring board App 20100051189 - Kawabata; Kenichi ; et al.	2010-03-04
Electronic component-embedded board and method of manufacturing the same App 20090025961 - Kanemaru; Yoshikazu ; et al.	2009-01-29
Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, thermosetting polyvinylbenzyl ether resin compo App 20050154110 - Takaya, Minoru ; et al.	2005-07-14
Composite Dielectric Material, Composite Dielectric Substrate, Prepreg, Coated Metal Foil, Molded Sheet, Composite Magnetic Substrate, Substrate, Double Side Metal Foil-clad Substrate, Flame Retardant Substrate, Polyvinylbenzyl Ether Resin Composition, Thermosettin Grant 6,908,960 - Takaya , et al. June 21, 2	2005-06-21
Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, and method for preparing thermosetting polyviny App 20050130447 - Takaya, Minoru ; et al.	2005-06-16
Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, thermosetting polyvinylbenzyl ether resin compo App 20050130446 - Takaya, Minoru ; et al.	2005-06-16
Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, thermosetting polyvinylbenzyl ether resin compo App 20020132898 - Takaya, Minoru ; et al.	2002-09-19

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