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Patent applications and USPTO patent grants for Ohata; Yu.The latest application filed is for "manufacture of a substrate structure for a composite semiconductor device using wafer bonding and epitaxial refill".
Patent | Date |
---|---|
Manufacture of a substrate structure for a composite semiconductor device using wafer bonding and epitaxial refill Grant 4,948,748 - Kitahara , et al. August 14, 1 | 1990-08-14 |
Semiconductor device with isolation between MOSFET and control circuit Grant 4,879,584 - Takagi , et al. November 7, 1 | 1989-11-07 |
Power MOS FET with carrier lifetime killer Grant 4,855,799 - Tanabe , et al. August 8, 1 | 1989-08-08 |
Silicon semiconductor substrate with an insulating layer embedded therein and method for forming the same Grant 4,837,186 - Ohata , et al. June 6, 1 | 1989-06-06 |
Method of manufacturing power MOSFET Grant 4,777,149 - Tanabe , et al. October 11, 1 | 1988-10-11 |
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